Abstract: The present invention generally relates to dosage forms for oral administration including one or more gelling agents. In particular, the present invention is directed to gelling agent-based dosage forms that are easily administered and taken, or swallowed. The present invention is also directed to gelling agent-based dosage forms that exhibit relatively low syneresis, are thermally stable, exhibit substantially constant active ingredient concentration, and/or exhibit one or more advantageous rheological properties. In particular, the present invention is directed to such gels containing one or more omega-3 fatty acids. The gelling agent-based dosage forms of the present invention are suitable for administration of a relatively large dose of active ingredient. The gelling agent-based dosage forms of the present invention are also suitable for administration of multiple active ingredients.

Abstract: The present invention generally relates to dosage forms for oral administration including one or more gelling agents. In particular, the present invention is directed to gelling agent-based dosage forms that are easily administered and taken, or swallowed. The present invention is also directed to gelling agent-based dosage forms that exhibit relatively low syneresis, are thermally stable, exhibit substantially constant active ingredient concentration, and/or exhibit one or more advantageous rheological properties. In particular, the present invention is directed to such gels containing one or more omega-3 fatty acids. The gelling agent-based dosage forms of the present invention are suitable for administration of a relatively large dose of active ingredient. The gelling agent-based dosage forms of the present invention are also suitable for administration of multiple active ingredients.

Abstract: The present invention generally relates to dosage forms for oral administration including one or more gelling agents. In particular, the present invention is directed to gelling agent-based dosage forms that are easily administered and taken, or swallowed. The present invention is also directed to gelling agent-based dosage forms that exhibit relatively low syneresis, are thermally stable, exhibit substantially constant active ingredient concentration, and/or exhibit one or more advantageous rheological properties. In particular, the present invention is directed to such gels containing one or more omega-3 fatty acids. The gelling agent-based dosage forms of the present invention are suitable for administration of a relatively large dose of active ingredient. The gelling agent-based dosage forms of the present invention are also suitable for administration of multiple active ingredients.

Abstract: The claimed invention relates to structures suitable for improving the performance and reliability of electrical connectors. One embodiment of the claimed invention includes an integrated circuit die having an electrical contact coupled with electrically conductive paths that share a common electrical source. The conductive paths are configured to transmit the same electrical signal to the electrical contact, which supports an electrical connector, such as a solder bump. The electrical connector couples the die with an outside component, such as a circuit board. Each of the conductive paths connect to the electrical contact at different interface locations. When the electrical signal passes through the interface locations, the paths are configured to have non-zero current densities at those locations. The electrical resistance of the conductive paths may be substantially similar.

Abstract: The claimed invention relates to structures suitable for improving the performance and reliability of electrical connectors. One embodiment of the claimed invention includes an integrated circuit die having an electrical contact coupled with electrically conductive paths that share a common electrical source. The conductive paths are configured to transmit the same electrical signal to the electrical contact, which supports an electrical connector, such as a solder bump. The electrical connector couples the die with an outside component, such as a circuit board. Each of the conductive paths connect to the electrical contact at different interface locations. When the electrical signal passes through the interface locations, the paths are configured to have non-zero current densities at those locations. The electrical resistance of the conductive paths may be substantially similar.

Abstract: The invention discloses an electrical interconnect with minimal parasitic capacitance. In one embodiment, an apparatus comprises a semiconductor substrate, and first and second support structures formed on the substrate, where the second support structure at least partially surrounds the first support structure on the substrate. The first and second support structures are each configured to support an electrical connector to be formed over the first and second support structures on the substrate.

Abstract: Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.