Abstract: The disclosed embodiments relate to dynamic performance of no application account tasks. A no application account task can include opening a new account for a client. A client interface can be presented on a client device associated with the client. The system can detect a request from the client device to generate the new account for the client that includes a single action on the client interface. The new account can be generated by mapping information relating to the new account with a client identifier associated with the client. The client interface can be updated to indicate that the new account is available to the client.

Abstract: The disclosed embodiments relate to performance of no application account tasks. A no application account task can include opening a new account for a client. A provider may retrieve client information associated with a client and determine whether the client is approved for one or more products offered by the provider. The new account can be generated by mapping information relating to the new account with a client identifier associated with the client. The client interface can be updated to include a display of the first product that is capable of being selected by the client or to confirm that a new account has been created.

Abstract: In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with one or more spacers.

Abstract: In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die.

Abstract: In one embodiment, an electronic device package (1) includes a leadframe (2) with a flag (3). An electronic chip (8) is attached to the flag (3) with a die attach layer (9). A trench (16) having curved sidewalls is formed in the flag (3) in proximity to the electronic chip (8) and surrounds the periphery of the chip (8). An encapsulating layer (19) covers the chip (8), portions of the flag (3), and at least a portion of the curved trench (16). The curved trench (16) reduces the spread of die attach material across the flag (3) during chip attachment, which reduces chip and package cracking problems, and improves the adhesion of encapsulating layer (19). The shape of the curved trench (16) prevents flow of die attach material into the curved trench (16), which allows the encapsulating layer (19) to adhere to the surface of the curved trench (16).

Abstract: In one exemplary embodiment, a multi-chip semiconductor connector is utilized for forming a semiconductor package having a plurality of semiconductor die. The multi-chip semiconductor connector is utilized to mechanically attach the plurality of semiconductor die together and to provide electrical connection to the plurality of semiconductor die.

Abstract: In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die.