Abstract: A computer-implemented method of performing radiation therapy on a target volume within an anatomical region of a patient includes: acquiring a cone-beam computed tomography (CBCT) image of the region while the region is positioned in a first preliminary treatment location; reconstructing a current digital volume of the region based on the CBCT image of the region; generating a first beam's-eye-view of the region based on the current digital volume and an offset between the first preliminary treatment location and a reference treatment location; modifying the first beam's-eye-view of the region with one or more visual cues associated with a treatment field for the target volume; and displaying the first beam's-eye-view with the one or more visual cues.

Abstract: An electronic device disposed in a package that includes: an interposer, fan-out interconnect (FOI), and a lid. The interposer having first size and first surface upon which die terminals (DTs) are disposed and are configured to electrically couple to integrated circuit die (IC), and second surface upon which substrate terminals (STs) are disposed and are configured to electrically couple to substrate. The IC has second size smaller than the first size, and the IC is mounted on the first surface in electrical contact with the DTs, the interposer is mounted on third surface, and the package substrate has third size, larger than the first size. The FOI establishes electrical interconnection between DTs and STs, the DTs have first pitch size and the STs have second pitch size, larger than first pitch size. The lid has first section, configured to abut fourth surface, and second section, mounted on the third surface.

Abstract: A first package includes a laminate layer, an overmold layer above and in direct contact with the laminate layer, and a logic circuit-through-silicon via (TSV) layer including a first logic die and TSVs. The logic circuit-TSV layer is within the overmold layer, and the TSVs are electrically exposed at a top surface of the overmold layer. The first package may be fabricated and tested by a first party prior to being provided to a second party. A second package includes a second logic die. The second party may attach the second package to the first package at the electrically exposed TSVs of the first package to realize a complete and functional semiconductor device.

Abstract: A first package includes a laminate layer, an overmold layer above and in direct contact with the laminate layer, and a logic circuit-through-silicon via (TSV) layer including a first logic die and TSVs. The logic circuit-TSV layer is within the overmold layer, and the TSVs are electrically exposed at a top surface of the overmold layer. The first package may be fabricated and tested by a first party prior to being provided to a second party. A second package includes a second logic die. The second party may attach the second package to the first package at the electrically exposed TSVs of the first package to realize a complete and functional semiconductor device.

Abstract: An electrically insulating substrate is provided. The electrically insulating substrate includes a set of areas to be formed into a set of printed circuit boards. Each of the set of areas is separated from others of the set of areas by a dicing channel. A set of signal wiring conductors is fabricated onto the set of areas of the electrically insulating substrate so that at least one of the set of signal wiring conductors terminates proximate to the dicing channel. A set of plated through holes is fabricated through at least one of the set of areas such that at least one of the set of plated through holes connects to at least one of the set of signal wiring conductors. The electrically insulating substrate is singulated along a set of singulation lines to form the set of printed circuit boards. The singulation lines intersect with the plated through holes, so that a portion of the plated through holes is exposed along the peripheral edge of the resulting printed circuit boards.

Abstract: A first package includes a laminate layer, an overmold layer above and in direct contact with the laminate layer, and a logic circuit-through-silicon via (TSV) layer including a first logic die and TSVs. The logic circuit-TSV layer is within the overmold layer, and the TSVs are electrically exposed at a top surface of the overmold layer. The first package may be fabricated and tested by a first party prior to being provided to a second party. A second package includes a second logic die. The second party may attach the second package to the first package at the electrically exposed TSVs of the first package to realize a complete and functional semiconductor device.

Abstract: An electrically insulating substrate is provided. The electrically insulating substrate includes a set of areas to be formed into a set of printed circuit boards. Each of the set of areas is separated from others of the set of areas by a dicing channel. A set of signal wiring conductors is fabricated onto the set of areas of the electrically insulating substrate so that at least one of the set of signal wiring conductors terminates proximate to the dicing channel. A set of plated through holes is fabricated through at least one of the set of areas such that at least one of the set of plated through holes connects to at least one of the set of signal wiring conductors. The electrically insulating substrate is singulated along a set of singulation lines to form the set of printed circuit boards. The singulation lines intersect with the plated through holes, so that a portion of the plated through holes is exposed along the peripheral edge of the resulting printed circuit boards.

Abstract: A nuclear magnetic resonance probe head comprising at least two coil/resonator configurations A1 and A2, wherein at least one of the coil/resonator configurations A1 has two saddle-shaped coils S1 and S2 (1, 2; 21; 41, 42; 53), wherein each coil (1, 2; 21; 41, 42; 53) has a window (9) about which N windings (3, 4; 26, 28, 30) are disposed which are connected in series, wherein N?2, wherein the coil/resonator configurations A1 and A2 are aligned perpendicularly to each other, and wherein the coil/resonator configurations A1 and A2 have different resonance frequencies is characterized in that each coil S1 and S2 (1, 2; 21; 41, 42; 53) is formed mirror-symmetrically relative to a central plane (5) of the respective coil (1, 2; 21; 41, 42; 53), which is perpendicular to the window (9) of the respective coil, and wherein the central planes (5) of the coils S1 and S2 are identical to minimize the electromagnetic coupling between the two coil/resonator configurations A1 and A2 at the resonance frequency of A2.

Abstract: Archery and firearm sight products and processes are disclosed. In an exemplary embodiment an apparatus may comprise a sight ring and a shaft. The sight ring may comprise a proximal end, a distal end, and a track. The track may comprise a major axis disposed substantially parallel with a vertical axis of the sight ring. The shaft may comprise a first end, a second end opposite the first end, and a body disposed between the first and second ends of the shaft. The first end of the shaft may be removably coupled with the sight ring and may be adapted to be displaced along the track of the sight ring.

Abstract: A method for determining sales tax in an automated purchasing system includes the steps of populating data entries in a master transaction record for one or more commodity items. Exemplary populated data entries include material group, cost center code and delivery address. Data corresponding to cost centers are mapped to tax categories representative of abridged functional use classifications. The tax category, material group, and physical location information determined either from the delivery address or from the cost center code are provided from the automated purchasing system to a supplemental software interface. Such data availability is enabled by various combination of user exits, data tables, and importation from temporary memory associated with the automated purchasing system. A tax rate (e.g.

Abstract: An automated purchasing method for buyers using a high volume database and a high volume software program that is compatible with SAP® business management software having an SAP material master database includes creating a new record upon having received a request for purchase of a new item, determining whether the new item is a high volume item, determining whether the new item has a matching entry in a high volume database, and either automatically or manually updating a purchasing info record and source list entry for the item. A requisition and purchase order for the new item may then be sent to a vendor. Optimized prices may be negotiated from the vendor based on documented records of the total items purchased from various respective manufacturers and vendors. Updates or discounts then applicable to the given purchase order are returned and updated in the high volume system such that those discounts and pricing updates are available for subsequent requests and purchases via the high volume program.