Abstract: A hairpiece attachment implant is taught wherein a subdermal base is implanted below the epidermal layer of the scalp and transdermal posts protruding through the scalp's epidermal layer provide nodes for attachment of a hairpiece prosthesis. The implants, which are made of a biocompatible material such as titanium or Crystal Sapphire, preferably comprises a plurality of elongate members connected so as to provide a subdermal base. The transdermal posts are connected to upper surfaces of the elongate members at generally perpendicular angles where the transdermal posts lie partially below the epidermal layer and partially exposed above the epidermal layer. A spherical connector preferably provides a means for releasably attaching the hairpiece to the platform via a ringed connector, or, alternatively, an aperture in the spherical connector provides a point where a ligature on the hairpiece can be tied down.