Patents by Inventor Stephen H. Sudyka

Stephen H. Sudyka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12094738
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: May 19, 2023
    Date of Patent: September 17, 2024
    Assignee: Elemental Scientific, Inc.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20240006201
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Application
    Filed: June 1, 2023
    Publication date: January 4, 2024
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20230395406
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Application
    Filed: May 19, 2023
    Publication date: December 7, 2023
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Patent number: 11804390
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: October 31, 2023
    Assignee: Elemental Scientific, Inc.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Patent number: 11705351
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: July 18, 2023
    Assignee: Elemental Scientific, Inc.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Patent number: 11694914
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: July 4, 2023
    Assignee: Elemental Scientific, Inc.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20230111929
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 13, 2023
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Patent number: 11476134
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: October 18, 2022
    Assignee: Elemental Scientific, Inc.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20220189794
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 16, 2022
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Patent number: 11244841
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: February 8, 2022
    Assignee: ELEMENTAL SCIENTIFIC, INC.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20210384047
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 9, 2021
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Patent number: 11049741
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 29, 2021
    Assignee: Elemental Scientific, Inc.
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20190172729
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Application
    Filed: November 26, 2018
    Publication date: June 6, 2019
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20190172731
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Application
    Filed: November 26, 2018
    Publication date: June 6, 2019
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
  • Publication number: 20190172730
    Abstract: Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
    Type: Application
    Filed: November 26, 2018
    Publication date: June 6, 2019
    Inventors: Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka