Abstract: Structures and methods for positioning heat sinks in contact with electronic devices are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device in accordance with one aspect of the invention includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device. The heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure further includes a spring holding portion configured to support a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.

Abstract: Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device, and the heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure can further include a spring holding portion configured to laterally support a coil spring. When the coil spring is laterally supported in the spring holding portion, the coil spring exerts a transverse compression force against the heat sink causing the heat sink to press against the electronic device with a uniform, or an approximately uniform, pressure.

Abstract: Systems and methods for cooling computer components in large computer systems are disclosed herein. In one embodiment, a computer system configured in accordance with aspects of the invention can include a computer module positioned in a chassis, and an air mover configured to move air through the chassis and past the computer module. The computer system can further include a pressure sensor operably coupled to the air mover. If the pressure sensor determines that the difference between a first air pressure inside the chassis and a second air pressure outside the chassis is less than a preselected pressure, the air mover can increase the flow of air through the chassis and past the computer module.