Patents by Inventor Stephen Hymes

Stephen Hymes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing composition and use thereof
    Publication number: 20050076580
    Abstract: An acidic aqueous slurry composition comprising silica abrasive particles, an oxidizer, a quaternary ammonium hydroxide; and acid having a maximum pKa of about 2.5; and water is provided along with its use for polishing.
    Type: Application
    Filed: October 10, 2003
    Publication date: April 14, 2005
    Applicant: Air Products and Chemicals, Inc.
    Inventors: Dynanesh Tamboli, Stephen Hymes, Gautam Banerjee
  • Process for achieving full global planarization during CMP of damascene semiconductor structures
    Patent number: 6350690
    Abstract: Described is a process for using chemical-mechanical planarization in the manufacture of Damascene structures that substantially reduces unwanted topography. The process is implemented in two stages to separate bulk metal removal and interface clearing. In stage 1 a top metal layer is planarized both globally and locally by CMP removal at a high rate of the preponderance of overlying metal, without penetrating to dielectric or barrier materials and with a minimum of CMP-generated global topography. For stage 2, the slurry is formulated with a 1:1:1 removal rate selectivity as to the metal/barrier/dielectric materials, the object being to preserve the highly flat topography achieved in stage 1.
    Type: Grant
    Filed: April 9, 1999
    Date of Patent: February 26, 2002
    Assignees: Advanced Micro Devices, Inc., Agere Systems Guardian Corp., Motorola, Inc.
    Inventors: Gary Paul Schwartz, Ramachandran Muralidhar, Stephen Hymes