Abstract: The present invention provides a dressing for application onto a wound. The dressing comprises a porous mesh having a wound-facing side coated with an adhesive for adhering the porous mesh to the skin. The porous mesh is also configured for application of a polymerizable adhesive such that after application the polymerized adhesive and the porous mesh together form a barrier covering the wound. The dressing also includes an absorbent patch disposed on the wound-facing side of the porous mesh and arranged to overlie the wound during use.

Abstract: Wound closure devices and related methods. In one example, a wound closure device includes a release liner and several wound closure meshes held in a removable fashion to the release liner. The release liner includes a main body and several tabs, with the tabs secured in a detachable fashion to the main body. Each wound closure mesh is held in a removable fashion to the main body of the release liner and at least one of the tabs, with the tab including a portion that extends outwardly from an outer perimeter of the mesh to which it is held.

Abstract: Described herein are compositions composed of a radiopaque agent and a cyanoacrylate monomer. These compositions cure in situ when administered to a subject and, thus, have numerous biomedical applications. The presence of the radiopaque agent allows the practitioner to visualize the compositions during and immediately after administration to the subject. The compositions are non-toxic and shelf-stable, and can be sterilized to prevent microbial growth. The compositions can be pre-mixed prior to sale and distribution, reducing the need for special training in their use.

Abstract: Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.

Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.

Abstract: A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

Abstract: The present disclosure provides 1k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate. The adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, and (b) mercapto-crosslinker.

Abstract: The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.

Abstract: A debondable adhesive composition comprises (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetra-siloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator. In further embodiments, this invention is an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition is disposed between the substrates, and a method for fabricating that assembly. The debondable adhesive composition maintains its adhesion at temperatures of 300° C. or greater, and is mechanically debondable at room temperature at a force less than 5N/25 mm.

Abstract: The present invention relates to a process for producing 2-cyanoacetic acid anhydride, comprising the steps of a) preparing a reaction mixture, containing as reactants 2-cyanoacetic acid, and at least one C4-20 carboxylic acid anhydride in at least one organic solvent, wherein the molar ratio of 2-cyanoacetic acid to C4-20 carboxylic acid anhydride in said reaction mixture is greater than 1.5:1, and b) subjecting the reaction mixture to a temperature of 0° C. to 100° C. to form 2-cyanoacetic acid anhydride. The present invention also relates to process for producing 2-cyanoacetic acid esters, 2-cyanoacetic acid amides and/or 2-cyanoacetic acid thioesters from 2-cyanoacetic acid anhydride.