Patents by Inventor Stephen J. Duckworth

Stephen J. Duckworth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5209987
    Abstract: An article of manufacture, for example a conductor for an electrical wire or cable, is provided with a refractory coating preferably formed from a refractory metal or semi-metal oxide or nitride and preferably deposited on the surface of the article by a vacuum deposition process such as a sputter ion plating method. Adhesion of the refractory coating, especially at high temperatures may be improved, and migration of the substrate metal through the coating may be suppressed by varying the stoichiometry of the coating through its thickness and/or by the provision of a metallic or refractory intermediate layer. The articles are particularly suitable for use in circuit and signal integrity cables.The vacuum deposited refractory layer may constitute the sole refractory, or additional refractory layers may be deposited by other methods e.g. a sol-gel method.
    Type: Grant
    Filed: October 30, 1990
    Date of Patent: May 11, 1993
    Assignee: Raychem Limited
    Inventors: Richard J. Penneck, James M. O'Brien, Stephen J. Duckworth, Nicholas J. G. Smith
  • Patent number: 4985313
    Abstract: An article of manufacture, for example a conductor for an electrical wire or cable, is provided with a refractory coating preferably formed from a refractory metal or semi-metal oxide or nitride and preferably deposited on the surface of the article by a vacuum deposition process such as a sputter ion plating method. Adhesion of the refractory coating, especially at high temperatures may be improved, and migration of the substrate metal through the coating may be suppressed by varying the stoichiometry of the coating through its thickness and/or by the provision of a metallic or refractory intermediate layer. The articles are particularly suitable for use in circuit and signal integrity cables.The vacuum deposited refractory layer may constitute the sole refractory, or additional refractory layers may be deposited by other methods e.g. a sol-gel method.
    Type: Grant
    Filed: January 14, 1986
    Date of Patent: January 15, 1991
    Assignee: Raychem Limited
    Inventors: Richard J. Penneck, James M. O'Brien, Stephen J. Duckworth, Nicholas J. G. Smith