Abstract: A transceiver-receiving system, such as a network switch with pluggable transceivers, is built with hardware and machine logic so that power to certain components is turned off when the pluggable transceiver is not present in its plug in slot. The machine logic for handling the turning off an on of power is present on a processor on the board to which the plug-in slot is attached. The other hardware for handling the turning on and off of the power includes a communication line from the plug-in slot to the processor, and a set of switch(es) located on the power path for the component(s) to be turned on and off according to the presence of absence of the transceiver.

Abstract: A breakout cable includes a data-lane module comprising a plurality of data lanes configured to send and receive a plurality of data signals, a plurality of breakout modules, and a plurality cables. Each breakout module is associated with a data lane and each cable interfaces with the data-lane module and a corresponding data lane to send and receive the plurality of signals between the data-lane module and a corresponding breakout module at a nominal 25 Gbps or a nominal 100 Gbps. In various embodiments, the data-lane module connects to a host and each of the plurality of modules connects to one or more system(s) to enable host-to-system(s) communications and system(s)-to-host communications at a nominal 100 Gbps or a nominal 400 Gbps.

Abstract: A circuit board has a first side and a second side opposite thereto. The board includes vias extending through the substrate from the first side to the second side, and via contact pads on the second side, each of which surrounds a corresponding via. The board includes a pair of surface mount contact pads on the second side. Each surface mount contact pad has a surface area and edges, each of which can have a shape to maximize the surface area while maintaining predetermined minimum separation distances. Each edge except one or more edges that are opposite another surface mount contact pad have a curved shape, and each edge opposite another surface mount contact pad have a linear shape. Curved edges adjacently opposite corresponding via contact pads can have curved shapes can have concave shapes, and curved edges not adjacently opposite via contact pads can have convex shapes.

Abstract: Embodiments of the present invention provide for a transmission line stub that includes a via stub of a conductive via. The conductive via includes a via stub and a coupling element, wherein a first transmission line configured to transmit a signal is coupled to the conductive via at the intersection of the via stub and the coupling element. The coupling element is configured to transmit the signal from the first transmission line. A line stub electrically coupled to the via stub, wherein the length of the line stub is selected such that the transmission line stub having a length of the sum of the lengths of the via stub and the line stub is configured to suppress a preselected frequency.

Abstract: A circuit board has a first side and a second side opposite thereto. The board includes vias extending through the substrate from the first side to the second side, and via contact pads on the second side, each of which surrounds a corresponding via. The board includes a pair of surface mount contact pads on the second side. Each surface mount contact pad has a surface area and edges, each of which can have a shape to maximize the surface area while maintaining predetermined minimum separation distances. Each edge except one or more edges that are opposite another surface mount contact pad have a curved shape, and each edge opposite another surface mount contact pad have a linear shape. Curved edges adjacently opposite corresponding via contact pads can have curved shapes can have concave shapes, and curved edges not adjacently opposite via contact pads can have convex shapes.

Abstract: An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.

Abstract: A breakout cable includes a data-lane module comprising a plurality of data lanes configured to send and receive a plurality of data signals, a plurality of breakout modules, and a plurality cables. Each breakout module is associated with a data lane and each cable interfaces with the data-lane module and a corresponding data lane to send and receive the plurality of signals between the data-lane module and a corresponding breakout module at a nominal 25 Gbps or a nominal 100 Gbps. In various embodiments, the data-lane module connects to a host and each of the plurality of modules connects to one or more system(s) to enable host-to-system(s) communications and system(s)-to-host communications at a nominal 100 Gbps or a nominal 400 Gbps.

Abstract: High-speed serial communications between programmable devices connected to an I2C bus that includes a serial clock channel (SCL) and a serial data channel (SDA), having at least a logical low state and a logical high state. The programmable device determines if the SCL channel is idle, indicated by a logical high state. Determining the SCL to be idle, the programmable device holds the SCL to a logical low state. The programmable device operates high-speed serial communications using the SDA channel while holding the SCL to the low logical state. In response to completion of the high-speed communications, the programmable device releases the SCL channel and the SCL channel returns to the logical high state.

Abstract: Embodiments of the present invention provide for a transmission circuit that includes a transmission line and a conductive via. The transmission line is electrically coupled to a first conductive via and a second conductive via. The first conductive via includes a first via stub, wherein the transmission line is configured to transmit a signal that is coupled to the first conductive via, and wherein the first via stub extends beyond the transmission line. The second conductive via includes a second via stub, wherein the transmission line is configured to transmit a signal that is coupled to the second conductive via, and wherein the second via stub extends beyond the transmission line. A transmission line stub is electrically coupled to the transmission line or to at least one of the conductive vias, wherein the length of the transmission line stub is configured to suppress a preselected frequency.

Abstract: A differential transmission line with a common mode notch filter includes adjacently arranged, repeating differential transmission line pair sections. The sections have lengths that are each equal to half of an electric wavelength of a lowest frequency of a common mode electromagnetic wave to be suppressed during transmission of an electric signal over the differential transmission line. Each section includes a pair of conductors separated from one another by a spacing. The width of each conductor and the spacing between the conductors of each section vary over the length thereof according to a same pattern such that at every point over the length of each section a differential mode impedance of the differential transmission line is identical. A common mode impedance of the differential transmission line changes periodically in accordance with the lengths of the sections.

Abstract: Embodiments of the present invention provide for a transmission line stub that includes a via stub of a conductive via. The conductive via includes a via stub and a coupling element, wherein a first transmission line configured to transmit a signal is coupled to the conductive via at the intersection of the via stub and the coupling element. The coupling element is configured to transmit the signal from the first transmission line. A line stub electrically coupled to the via stub, wherein the length of the line stub is selected such that the transmission line stub having a length of the sum of the lengths of the via stub and the line stub is configured to suppress a preselected frequency.

Abstract: Embodiments of the present invention provide for a transmission circuit that includes a transmission line and a conductive via. The transmission line is electrically coupled to a first conductive via and a second conductive via. The first conductive via includes a first via stub, wherein the transmission line is configured to transmit a signal that is coupled to the first conductive via, and wherein the first via stub extends beyond the transmission line. The second conductive via includes a second via stub, wherein the transmission line is configured to transmit a signal that is coupled to the second conductive via, and wherein the second via stub extends beyond the transmission line. A transmission line stub is electrically coupled to the transmission line or to at least one of the conductive vias, wherein the length of the transmission line stub is configured to suppress a preselected frequency.

Abstract: A transceiver-receiving system, such as a network switch with pluggable transceivers, is built with hardware and machine logic so that power to certain components is turned off when the pluggable transceiver is not present in its plug in slot. The machine logic for handling the turning off an on of power is present on a processor on the board to which the plug-in slot is attached. The other hardware for handling the turning on and off of the power includes a communication line from the plug-in slot to the processor, and a set of switch(es) located on the power path for the component(s) to be turned on and off according to the presence of absence of the transceiver.

Abstract: The present invention proposes methods and structures for designing electronic circuit elements for frequency suppression of electromagnetic waves using a transmission line grating. The method includes determining a frequency to be suppressed. Using the electrical wavelength of the frequency to be suppressed, determine a length of a plurality of equal length sections of the differential transmission lines is determined. Using the frequency to be suppressed and the electronic circuit requirements, determine a set of properties for the plurality of equal length sections of the differential transmission lines. The transmission line grating is created using a plurality of alternating equal length sections of the differential transmission lines.

Abstract: A method is used for designing a multilayered circuit substrate that generates a physical design layout. The physical design layout represents of at least one electrical circuit passing through a plurality of layers. Based on performance requirements of the electrical circuit, a maximum allowable stub length of a via in the electrical circuit is computed. The computer processor determines if a stub length of an existing via in the physical design layout of the electrical circuit is less than the maximum allowable stub length. If the computer determines that the stub length of the existing via is less than the maximum allowable stub length, the computer removes an external non-functional pad of the existing via from the physical design layout.

Abstract: An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.

Abstract: High-speed serial communications between programmable devices connected to an I2C bus that includes a serial clock channel (SCL) and a serial data channel (SDA), having at least a logical low state and a logical high state. The programmable device determines if the SCL channel is idle, indicated by a logical high state. Determining the SCL to be idle, the programmable device holds the SCL to a logical low state. The programmable device operates high-speed serial communications using the SDA channel while holding the SCL to the low logical state. In response to completion of the high-speed communications, the programmable device releases the SCL channel and the SCL channel returns to the logical high state.