Patents by Inventor Stephen J. Tirch, III

Stephen J. Tirch, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6340626
    Abstract: A method for making a metallic pattern that includes redundant photolithography to significantly reduce the occurrence of defects in the metal layer that defines the desired metallic pattern. The presence of contaminants in the photoresist layer during exposure and developing away of portions of a photoresist layer can cause defects in the metal layer that defines the desired metallic pattern. Contaminants in the photoresist layer prevent portions of the photoresist layer from being exposed and developed away, so that portions of the photoresist layer that should be developed away remain in place, thereby causing the development of defects in the metal layer that defines the desired metallic pattern. These contaminants move to different positions during the developing away of the photoresist.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: January 22, 2002
    Assignee: International Business Machines Corporation
    Inventors: Kamalesh S. Desai, Brian D. Husson, Mathias P. Jeanneret, Stephen J. Tirch, III
  • Patent number: 6235544
    Abstract: A multilayer thin film structure (MLTF) is provided having no extraneous via-pad connection strap plated metallurgy for defective vias needing removal. The method for making or repairing the MLTF comprises determining interconnection defects in the MLTF at a thin film layer adjacent to the top metal layer of the structure, applying a top surface dielectric layer and forming vias in the layer, applying a metal conducting layer and removing the metal conducting layer for via-pad connection straps of defective vias and at the intersection of XY lines used in the repair, defining the top surface metallization including a series of orthogonal X conductor repair lines and Y conductor repair lines using a photoresist and lithography and then using a phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization using additive or subtractive metallization techniques.
    Type: Grant
    Filed: April 20, 1999
    Date of Patent: May 22, 2001
    Assignee: International Business Machines Corporation
    Inventors: Peter A. Franklin, Charles J. Hendricks, Richard P. Surprenant, Stephen J. Tirch, III, Thomas A. Wassick, James P. Wood
  • Patent number: 5609778
    Abstract: A process for forming parabolic micro-reflectors on an object includes the steps of placing the object proximate to a transfer lens system, shining a laser beam through the lens system, a mask and a wobble plate and onto the object, the wobble plate wobbling the laser beam such that a parabolic shaped micro-reflector is formed on the object.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: March 11, 1997
    Assignee: International Business Machines Corporation
    Inventors: Doris P. Pulaski, Richard T. Anderson, Christopher L. Tessler, Stephen J. Tirch, III, Dawn J. Tudryn