Patents by Inventor Stephen J. VETTER

Stephen J. VETTER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for manufacturing a PCB
    Patent number: 10980126
    Abstract: Apparatus and methods are provided which enable a capacity to remotely enable research, development, and production tasks to be done at a point of use (POU) as well as permitting some design tasks to be done remotely with manufacturing employing, for example, additive manufacturing (AM), for printed circuit boards (PCB) as well as other electrical items. In particular, some embodiments are directed towards facilitating POU on-site manufacturing capacity with a remote or distributed requirements/design process.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: April 13, 2021
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventor: Stephen J. Vetter
  • PRINTED CIRCUIT BOARD FABRICATION PROCESSES AND ARCHITECTURE INCLUDING POINT-OF-USE DESIGN AND FABRICATION CAPACITY EMPLOYING ADDITIVE MANUFACTURING
    Publication number: 20190029117
    Abstract: Apparatus and methods are provided which enable a capacity to remotely enable research, development, and production tasks to be done at a point of use (POU) as well as permitting some design tasks to be done remotely with manufacturing employing, for example, additive manufacturing (AM), for printed circuit boards (PCB) as well as other electrical items. In particular, some embodiments are directed towards facilitating POU on-site manufacturing capacity with a remote or distributed requirements/design process.
    Type: Application
    Filed: August 30, 2018
    Publication date: January 24, 2019
    Applicant: The United States of America, as represented by the Secretary of the Navy
    Inventor: Stephen J. Vetter
  • Printed circuit board fabrication processes and architecture including point-of-use design and fabrication capacity employing additive manufacturing
    Patent number: 10070532
    Abstract: Apparatus and methods are provided which enable a capacity to remotely enable research, development, and production tasks to be done at a point of use (POU) as well as permitting some design tasks to be done remotely with manufacturing employing, for example, additive manufacturing (AM), for printed circuit boards (PCB) as well as other electrical items. In particular, some embodiments are directed towards facilitating POU on-site manufacturing capacity with a remote or distributed requirements/design process.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: September 4, 2018
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventor: Stephen J. Vetter
  • PRINTED CIRCUIT BOARD FABRICATION PROCESSES AND ARCHITECTURE INCLUDING POINT-OF-USE DESIGN AND FABRICATION CAPACITY EMPLOYING ADDITIVE MANUFACTURING
    Publication number: 20160324006
    Abstract: Apparatus and methods are provided which enable a capacity to remotely enable research, development, and production tasks to be done at a point of use (POU) as well as permitting some design tasks to be done remotely with manufacturing employing, for example, additive manufacturing (AM), for printed circuit boards (PCB) as well as other electrical items. In particular, some embodiments are directed towards facilitating POU on-site manufacturing capacity with a remote or distributed requirements/design process.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 3, 2016
    Inventor: Stephen J. Vetter
  • CROSS CONNECT VIA FOR MULTILAYER PRINTED CIRCUIT BOARDS
    Publication number: 20040108137
    Abstract: A printed circuit board (B) with a mechanical attachment of connector pins (42a and 42b) to opposite sides of the same plated through location (34) maintains electrical isolation between the board sides (14 and 16). A sequence of controlled depth drilling steps creates a hole (34) through the printed circuit board (B) with multiple diameters (20, 24, 30 and 40).
    Type: Application
    Filed: July 21, 2003
    Publication date: June 10, 2004
    Applicant: LITTON SYSTEMS, INC.
    Inventors: Stephen J. VETTER, Thomas D. MURRY, Randolph A. LATALL, Sharon L. COOK, Eric W. MONTGOMERY