Abstract: Methods of electroforming fuel injector nozzle structures such as, e.g., nozzle plates, valve guides, combinations of nozzle plates and valve guides, etc., as well as other articles incorporating microstructured features. The methods described herein can be used to electroform articles with high aspect ratio features in close proximity while reducing the likelihood of void formation during the electroforming process.

Abstract: In one embodiment, a semiconductor component, such as a wavelength converter wafer, is described wherein the wavelength converter is bonded to an adjacent inorganic component with a cured bonding layer comprising polysilazane polymer. The wavelength converter may be a multilayer semiconductor wavelength converter or an inorganic matrix comprising embedded phosphor particles. In another embodiment, the semiconductor component is a pump LED component bonded to an adjacent component with a cured bonding layer comprising polysilazane polymer. The adjacent component may the described wavelength converter(s) or another component comprised of inorganic material(s) such as a lens or a prism. Also described are methods of making semiconductor components such as wavelength converters and LED's.

Abstract: In one embodiment, a semiconductor component, such as a wavelength converter wafer, is described wherein the wavelength converter is bonded to an adjacent inorganic component with a cured bonding layer comprising polysilazane polymer. The wavelength converter may be a multilayer semiconductor wavelength converter or an inorganic matrix comprising embedded phosphor particles. In another embodiment, the semiconductor component is a pump LED component bonded to an adjacent component with a cured bonding layer comprising polysilazane polymer. The adjacent component may the described wavelength converter(s) or another component comprised of inorganic material(s) such as a lens or a prism. Also described are methods of making semiconductor components such as wavelength converters and LED's.

Abstract: A fiber alignment device comprises a base having at least one alignment groove, a stripped portion of an optical fiber positioned in the at least one alignment groove, where a terminal end of the fiber extends beyond at least one of an end face of the base, and an end face of a cover bonded to the base to secure the optical fiber between the base and the cover, where an end face of the cover and the end face of the base are substantially non-parallel.

Abstract: An optical device comprises a cantilevered fiber array coupled to a planar lightwave circuit. The cantilevered fiber array comprises a base supporting at least a portion of at least one optical fiber in a fiber guiding channel and a cover bonded to the base and/or the at least one optical fiber, where a terminal end of the at least one optical fiber extends beyond an end of at least one of the base and cover. The planar lightwave circuit comprises a planar waveguide formed on a substrate, the planar waveguide including a waveguide core. The terminal end of the fiber of the cantilevered fiber array is disposed in an alignment groove formed in a portion of the planar lightwave circuit substrate. A transverse channel is formed in the planar lightwave circuit substrate at an optical interface of the waveguide core and the terminal end of the at least one optical fiber.