Patents by Inventor Stephen John FUNK

Stephen John FUNK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EXTENDED PAD AREA TO PREVENT PRINTED CIRCUIT BOARD DAMAGE
    Publication number: 20240074067
    Abstract: A printed circuit board having an electrically insulative layer and a conductive solder pad. The conductive solder pad is disposed at least partially over the electrically insulative layer, and defines a solder contact area. The solder contact area is configured for making an electrical connection to an electrical component via laser soldering. The printed circuit board further includes a solder mask coating the conductive solder pad and defining an exposed area of the conductive solder pad. The conductive solder pad protects the electrically insulative layer from incident heat during the laser soldering by extending a length underneath the solder mask along a periphery of the exposed area.
    Type: Application
    Filed: August 31, 2023
    Publication date: February 29, 2024
    Applicant: Kollmorgen Corporation
    Inventors: Jeffery Todd BREWSTER, William Edward ANDERSON, IV, Stephen John FUNK