Abstract: A colour ink printing system, includes a plurality of print head cartridges, each extending across a direction of print media propagation and spaced apart along the direction of print media propagation; a print head chassis for supporting the plurality of print head cartridges, the print head chassis actuable between a printing position, a transition position, and a maintenance position; a maintenance chassis for supporting a plurality of maintenance cradles, the maintenance chassis actuable between a storage position and an operational position; and a platen on which the print media is supported and propagated. Each of the plurality of print head cartridges is held stationary with respect to a platen on which print media is propagated to effect printing on the print media. Each of the plurality of print head cartridges is a monochrome print head cartridge ejecting a fluid different to the remaining plurality of print head cartridges.

Abstract: A colour ink printing system includes a plurality of print head cartridges, each extending across a direction of print media propagation and spaced apart along the direction of print media propagation; a print head chassis for supporting the plurality of print head cartridges, the print head chassis actuable between a printing position, a transition position, and a maintenance position; and a maintenance chassis for supporting a plurality of maintenance cradles, the maintenance chassis actuable between a storage position and an operational position, each maintenance cradle including a capper and a cleaner. Each of the plurality of print head cartridges is held stationary with respect to a platen on which print media is propagated to effect printing on the print media. Each of the plurality of print head cartridges is a monochrome print head cartridge ejecting a fluid different to the remaining plurality of print head cartridges.

Abstract: A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area.

Abstract: A pressure-based tester for testing an integrity of a printhead integrated circuit (IC) carrier includes a housing assembly; a cradle assembly coupled to the housing assembly and adapted to receive the printhead IC carrier, the cradle assembly further defining spouts adapted to engage with the printhead IC carrier; a regulated gas supply arranged in the housing assembly; a first gas supply line in fluid communication with the regulated gas supply; a pneumatic retaining mechanism in fluid communication with the gas supply via the first gas supply line, the pneumatic retaining mechanism for retaining the carrier in fluid communication with the spouts during testing of the platform assembly; a second gas supply line in fluid communication with the regulated gas supply, the second gas supply line being separated from the first gas supply line by a pressure regulator, the second gas supply line for supplying gas to the spouts; a pressure sensor for measuring a gas pressure at each spout and generating a signal ind

Abstract: The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism.

Abstract: A cradle assembly for a pressure decay leak tester is provided. The assembly operatively receives a printhead integrated circuit carrier having a plurality of printing fluid paths defined therein, respective fluid inlets in fluid communication with respective fluid paths and a locating formation to facilitate correct location of the carrier on the tester. The assembly includes at least one complementary locating formation for engaging the locating formation of the carrier, and at least one fluid outlet for charging the carrier with fluid via a respective fluid inlet of the carrier. Also included is a clamping device for clamping the carrier to the fluid outlet, so that the integrity of the fluid paths is observable via pressure decay testing, and a control system operatively connected to the clamping device for controlling operation of the clamping device.

Abstract: A pneumatic assembly for a pressure decay tester of printhead integrated circuits includes a pressurized air supply. A pneumatic clamping arrangement is in fluid communication with the pressurized air supply for clamping a carrier for the printhead integrated circuits such that the carrier is in fluid communication with the printhead integrated circuits. A valve arrangement applies a predetermined pressure to the carrier. A sensing arrangement senses a static pressure in the carrier. A control system is in communication with the clamping, valve and sensing arrangements to control operation thereof and to generate a discernible signal representing said static pressure such that a decay in said static pressure can be determined.

Abstract: The invention provides for a pressure-based tester for testing integrity of a platform assembly. The platform assembly includes a pair of assembled platform components fastened together and a fluid path extending into both components, the platform assembly suitable for supporting printhead integrated circuits to be tested. The tester includes a housing assembly, a regulated gas supply arranged in the housing assembly, and a retaining mechanism in fluid communication with the gas supply and configured to retain the platform assembly in fluid communication with the gas supply during testing of the platform assembly.

Abstract: Provided is a leak tester for a carrier for printhead integrated circuits. The carrier has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The tester includes a support assembly that includes at least one receptacle shaped and configured to receive at least one respective carrier, and a pressurized fluid supply arranged on the support assembly and configured to supply pressurized fluid to the fluid inlets, the pressurized fluid supply incorporating a sealing mechanism configured to engage the fluid inlets in a sealing manner.

Abstract: A method for connecting a flexible printed circuit board (PCB) to a printhead assembly that includes a printhead carrier and an ink ejection printhead carried by the carrier.

Abstract: The invention provides for a diagnostic probe assembly for a tester which is used to diagnose printhead integrated circuits. The probe assembly includes a support assembly and a controller board mounted on the support assembly and having a processor configured to generate test signals for testing a printhead integrated circuit. A routing board is in operative signal communication with the controller board and is configured to multiplex the generated test signals for respective dies of the printhead integrated circuits. The probe assembly also includes a probe interface in signal communication with the routing board and configured for relaying the multiplexed test signals to and from the respective dies.

Abstract: A testing apparatus for testing integrated circuits mounted in a carrier includes a support assembly. A controller is mounted in the support assembly. The controller is programmed to process test signals from the integrated circuits. A retaining assembly is arranged on the support assembly and is configured to receive and retain the carrier during testing. A displacement mechanism is arranged on the support assembly for displacing the retaining assembly relative to the support assembly into and out of an operative condition. Testing circuitry is operatively connected to the controller and has at least test signal generation and measurement circuitry and adaptor circuitry for operative engagement with the integrated circuits being tested, the adaptor circuitry being configured to provide both a physical and an electrical interface with the integrated circuits.

Abstract: A method for testing integrated circuits mounted on a carrier includes the step of securing the carrier. The carrier is displaced into an operative position in which the integrated circuits are in physical and electrical communication with a diagnostic probe. Test signals are generated in test circuitry in electrical communication with the diagnostic probe and communicated to the integrated circuits with the diagnostic probe. The test signals are received at the test circuitry via the diagnostic probe. The test signals are made available to a controller via a communications link and an automated server and displayed with the controller.

Abstract: Provided is a method for testing integrity of a base for printhead integrated circuits. The base has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The method includes the steps of engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner, charging the base with pressurized fluid until a predetermined pressure is reached, and monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base.

Abstract: This invention provides for a test stage for a printhead integrated circuit tester for testing operation of printhead integrated circuits mounted on a carrier. The test stage includes a support structure. A fixture is arranged on the support structure and is configured to receive and locate the carrier. A clamping mechanism is arranged on the fixture. The clamping mechanism has at least one clamp assembly for clamping the carrier to the test stage. A controller controls operation of the clamping mechanism.

Abstract: The invention provides for a pressure-based tester for testing integrity of a platform assembly. The platform assembly includes a pair of assembled platform components fastened together and a fluid path extending into both components, the platform assembly suitable for supporting printhead integrated circuits to be tested. The tester includes a housing assembly, a regulated gas supply arranged in the housing assembly, and a retaining mechanism in fluid communication with the gas supply and configured to retain the platform assembly in fluid communication with the gas supply during testing of the platform assembly.

Abstract: Provided is a method for testing integrity of a base for printhead integrated circuits. The base has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The method includes the steps of engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner, charging the base with pressurized fluid until a predetermined pressure is reached, and monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base.

Abstract: Provided is a leak tester for a carrier for printhead integrated circuits. The carrier has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The tester includes a support assembly that includes at least one receptacle shaped and configured to receive at least one respective carrier, and a pressurized fluid supply arranged on the support assembly and configured to supply pressurized fluid to the fluid inlets, the pressurized fluid supply incorporating a sealing mechanism configured to engage the fluid inlets in a sealing manner.

Abstract: The invention relates to a bonding apparatus for bonding a carrier sheet used for carrying printhead integrated circuits to a carrier base. The apparatus includes a support assembly configured to receive and support the carrier base, and a lamination head arranged on the support assembly and configured to bond the carrier sheet to the carrier base. Further included are a conformal material supply mechanism arranged on the support assembly and configured to interpose a conformal material between the surface and the head prior to bonding, and a controller to control operation of the lamination head and the supply mechanism to facilitate bonding of the carrier sheet to the carrier base.

Abstract: The invention provides for a diagnostic probe assembly for a tester which is used to diagnose printhead integrated circuits. The probe assembly includes a support assembly and a controller board mounted on the support assembly and having a processor configured to generate test signals for testing a printhead integrated circuit. A routing board is in operative signal communication with the controller board and is configured to multiplex the generated test signals for respective dies of the printhead integrated circuits. The probe assembly also includes a probe interface in signal communication with the routing board and configured for relaying the multiplexed test signals to and from the respective dies.