Patents by Inventor Stephen Joy

Stephen Joy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11180484
    Abstract: The present invention provides a selection of compounds of formula (I): (I) compositions comprising such compounds; the use of such compounds in therapy (for example in the treatment or prevention of a disease or condition in which plasma kallikrein activity is implicated); and methods of treating patients with such compounds; wherein R5, R6, R7, A, B, W, X, Y and Z are as defined herein.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: November 23, 2021
    Assignee: KalVista Pharmaceuticals Limited
    Inventors: Rebecca Louise Davie, Hanna Joy Edwards, David Michael Evans, Simon Teanby Hodgson, Stephen John Pethen, David Philip Rooker
  • Publication number: 20210355188
    Abstract: The present invention relates to T cell receptors (TCRs) that bind the HLA-A*02 restricted peptide SLLQHLIGL (SEQ ID NO: 1) derived from the germline cancer antigen PRAME. Said TCRs may comprise non-natural mutations within the alpha and/or beta variable domains relative to a native PRAME TCR. The TCRs of the invention are particularly suitable for use as novel immunotherapeutic reagents for the treatment of malignant disease.
    Type: Application
    Filed: June 19, 2018
    Publication date: November 18, 2021
    Inventors: Philip William ADDIS, Nicole Joy BEDKE, Lucie BOUARD, Stephen HARPER, Nathaniel LIDDY, Tara MAHON, Ronan Pádraic O'DWYER
  • Patent number: 9376469
    Abstract: The present invention relates to peptidomimetics having a stable, internally constrained protein secondary structure, where the peptidomimetics contain a hydrogen bond surrogate in the internal constraint, and at least one beta amino acid. Methods for promoting cell death using peptidomimetics that inhibit p53/hDM2 are also disclosed.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: June 28, 2016
    Assignee: New York University
    Inventors: Paramjit S. Arora, Anupam Patgiri, Stephen Joy
  • Publication number: 20050286238
    Abstract: An interconnection structure for coupling conductive layers of a circuit board includes a pin configured to be press-fitted in an aperture traversing the circuit board, to electrically couple the conductive traces. The pin may be placed in a predrilled aperture, or driven into the circuit board, forming the aperture thereby. The pin may also be configured as a punch, removing a plug of material as it is driven therethrough. The pin may comprise a capacitive or resistive region configured to capacitively or resistively couple the first and second traces. The pin may be configured such that capacitive or resistive values are selectable according to a depth to which the pin is positioned in the aperture. The pin may serve as an offset post for mounting the circuit board to a chassis. In such a case, the pin may be provided with a longitudinal aperture configured to receive a threaded screw.
    Type: Application
    Filed: June 24, 2004
    Publication date: December 29, 2005
    Inventor: Stephen Joy
  • Publication number: 20050090040
    Abstract: The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit (IC) are coupled to printed circuit board (PCB) bonding pads that include vias. According to an embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. The bonding pads are separated into two groups, each having vias offset in a different direction, so that asymmetric surface tension forces in the molten solder during a solder reflow operation do not cause the IC to slide to one side. A substrate, an electronic assembly, an electronic system, and fabrication methods are also described.
    Type: Application
    Filed: November 22, 2004
    Publication date: April 28, 2005
    Inventors: Phil Geng, Stephen Joy
  • Patent number: 6603487
    Abstract: In an exemplary embodiment, a customer, an automobile dealership, a participating financial institution, and a credit bureau may be electronically connected in a system that preferably uses the internet in order to develop and process a legal document comprising a credit application. The system thereby eliminates a paper-based process of credit approval, providing an efficient interaction between businesses and their customer.
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: August 5, 2003
    Assignee: International Business Machines Corporation
    Inventors: William Edward Bennett, Stephen Joy Boies, Lauretta Jones, Stephen Eric Levy, Douglas Charles Lovell, Neil Lustig, Paul Michael Matchen, Richard Dean Thompson
  • Patent number: 6138160
    Abstract: A wake up server permits both parties (the receiver and the responder) to be connected to the Internet only when a request or response is to be delivered. The wake up server consists of two parts; a server, which contains the telephone numbers of all machines (application partners) that dial to connect to the Internet, and on each application partner, a process monitor that monitors the telephone line and detects when a ring occurs. When an application partner is unable to deliver a request or response to another application partner, a request is sent to the wake up server to activate the target application partner. The wake up server dials the telephone number of the requested application partner and waits for ringing to occur. The wake up server then disconnects (i.e., hangs up the telephone line). The wake up monitor detects the ring and immediately dials to connect to the Internet. When the original application partner tries to send the response or request again, the process will now be successful.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: October 24, 2000
    Assignee: International Business Machines Corporation
    Inventors: Stephen Joy Boies, Stephen Eric Levy, Michael J. Ryan
  • Patent number: 6006200
    Abstract: Transactions are conducted on the Internet, by telephone or directly with anonymity and privacy. A customer's shipping address is encoded by a multi-digit identifier which is stored in the database of a trusted third party, preferably the shipping company. A user of the system need only identify themselves to a vendor by this multi-digit identifier which prints the identifier in machine readable form on a package delivered to the shipper.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: December 21, 1999
    Assignee: International Business Machines Corporation
    Inventors: Stephen Joy Boies, Susan Lynn Spraragen