Patents by Inventor Stephen KEELE

Stephen KEELE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon photonic systems for LIDAR applications
    Patent number: 12481035
    Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: November 25, 2025
    Assignee: Intel Corporation
    Inventors: Eleanor Patricia Paras Rabadam, Guiyun Bai, Israel Petronius, Sushrutha Gujjula, Ronald L. Spreitzer, Kenneth Brown, Konstantin Matyuch, Boping Xie, Stephen Keele, Qifeng Wu, Ankur Agrawal, Jonathan Doylend, Sanjeev Gupta, Sam Khalili, Daniel Grodensky, Nan Kong Ng, Ron Friedman, Gal Dvoretzki
  • SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS
    Publication number: 20220404474
    Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.
    Type: Application
    Filed: December 21, 2021
    Publication date: December 22, 2022
    Inventors: Eleanor Patricia Paras Rabadam, Guiyun Bai, Israel Petronius, Sushrutha Gujjula, Ronald L. Spreitzer, Kenneth Brown, Konstantin Matyuch, Boping Xie, Stephen Keele, Qifeng Wu, Ankur Agrawal, Jonathan Doylend, Sanjeev Gupta, Sam Khalili, Daniel Grodensky, Nan Kong Ng, Ron Friedman, Gal Dvoretzki
  • PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
    Publication number: 20210210478
    Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.
    Type: Application
    Filed: March 3, 2021
    Publication date: July 8, 2021
    Inventors: Susheel JADHAV, Juan DOMINGUEZ, Ankur AGRAWAL, Kenneth BROWN, Yi LI, Jing CHEN, Aditi MALLIK, Xiaoyu HONG, Thomas LILJEBERG, Andrew C. ALDUINO, Ling LIAO, David HUI, Ren-Kang CHIOU, Harinadh POTLURI, Hari MAHALINGAM, Lobna KAMYAB, Sasanka KANUPARTHI, Sushrutha Reddy GUJJULA, Saeed FATHOLOLOUMI, Priyanka DOBRIYAL, Boping XIE, Abiola AWUJOOLA, Vladimir TAMARKIN, Keith MEASE, Stephen KEELE, David SCHWEITZER, Brent ROTHERMEL, Ning TANG, Suresh POTHUKUCHI, Srikant NEKKANTY, Zhichao ZHANG, Kaiyuan ZENG, Baikuan WANG, Donald TRAN, Ravindranath MAHAJAN, Baris BICEN, Grant SMITH