Patents by Inventor Stephen Khuen Wong

Stephen Khuen Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060191629
    Abstract: A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.
    Type: Application
    Filed: June 15, 2004
    Publication date: August 31, 2006
    Inventors: Jun Wei, Stephen Khuen Wong, Sharon Ling Nai