Abstract: An electronic module that operates at various radio frequency standards is provided. The module includes a first integrated circuit die formed in a first semiconductor substrate and manufactured using a first semiconductor process. Disposed within the first integrated circuit is the first signal conditioning circuit for performing a function and a first ancillary circuit. The first ancillary circuit electrically coupled to the first signal conditioning circuit for use by the first signal conditioning circuit during operation thereof. Also within the module is a second integrated circuit formed in a semiconductor substrate, disposed within the second integrated circuit is a second signal conditioning circuit. The second signal conditioning circuit being electrically coupled to the first ancillary circuit such that during operation the first ancillary circuit is connected to either one of the first signal conditioning circuits or one of the second signal conditioning circuits.

Abstract: A leadframe and a semiconductor package including such a lead frame, are provided by embodiments of the invention. The leadframe includes a die flag, leads, and a radio frequency (RF) passive component integrally formed into the leadframe. Examples of the RF passive component can be an antenna, such as a spiral or serpentine antenna or one or more transmission lines that can be used as a coupler or filter. The RF passive component can also be tuned to particular frequency values and ranges depending on the particular location of attachment to the RF passive component. The semiconductor package further comprises a semiconductor die and a coupling means with which to connect to the RF passive component to another location on the leadframe, such as the leads and/or the semiconductor die. The semiconductor package may also be encapsulated in a non-conductive material to protect the semiconductor die, coupling means and RF passive component.

Abstract: Within an amplifier circuit having an amplifying transistor, a boost voltage is presented at a port of the transistor. The amplifying transistor has a base, an emitter and a collector or a gate, a source, and a drain. A capacitor is provided in electrical communication with the transistor. A voltage source is provided for providing one of the collector and the source with a first voltage and for in a first mode of operation charging the first capacitor. Also within the circuit is a switch for switching between the first mode of operation and a second other mode of operation wherein the first capacitor and the voltage source cooperate to provide a voltage at one of the collector and the source in excess of the first voltage.

Abstract: A direct attach optical receiver module and a system and method for testing the direct attach optical receiver module are provided. An optical receiver module may include an optical detector and an integrated circuit with an integrated amplifier circuit and at least one integrated capacitor. In one example, the optical detector may be physically attached to the integrated circuit and the output port of the optical detector may be electrically coupled to the input port of the integrated circuit. In another example, a redistribution layer that includes a tuning inductor may be being physically attached between the optical detector and the integrated circuit.