Abstract: The invention comprises methods of forming pluralities of capacitors. In one implementation, metal is formed over individual capacitor storage node locations on a substrate. A patterned masking layer is formed over the metal. The patterned masking layer comprises openings therethrough to an outer surface of the metal. Individual of the openings are received over individual of the capacitor storage node locations. A pit is formed in the metal outer surface within individual of the openings. After forming the pits, the metal is anodically oxidized through the openings effective to form a single metal oxide-lined channel in individual of the openings over the individual capacitor storage nodes. Individual capacitor electrodes are formed within the channels in electrical connection with the individual capacitor storage node locations. At least some of the metal oxide is removed from the substrate, and the individual capacitor electrodes are incorporated into a plurality of capacitors.

Abstract: Processes for enhancing solubility and the reaction rates in supercritical fluids are provided. In preferred embodiments, such processes provide for the uniform and precise deposition of metal-containing films on semiconductor substrates as well as the uniform and precise removal of materials from such substrates. In one embodiment, the process includes, providing a supercritical fluid containing at least one reactant, the supercritical fluid being maintained at above its critical point, exposing at least a portion of the surface of the semiconductor substrate to the supercritical fluid, applying acoustic energy, and reacting the at least one reactant to cause a change in at least a portion of the surface of the semiconductor substrate.

Abstract: An apparatus for conditioning a polishing pad, or conditioner, includes a supporting substrate and abrasive elements. The abrasive elements of the conditioner are used to condition a polishing pad to be used in abrasive, or at least partially mechanical, semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.

Abstract: Metal and/or silicon oxides are produced by hydrolysis of alkoxide precursors in the presence of either an acid catalyst or a base catalyst in a supercritical fluid solution. The solubility of the acid catalysts in the supercritical fluid can be increased by complexing the catalyst with a Lewis base that is soluble in the supercritical fluid. The solubility of the base catalysts in the supercritical fluid can be increased by complexing the catalyst with a Lewis acid that is soluble in the supercritical fluid. The solubility of water in the solution is increased by the interaction with the acid or base catalyst.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to a solvent to remove material from one of the first or second portions of the planarizing pad material at a faster rate than removing material from the other of the first and second portions. The process forms a plurality of recesses directly in the surface of the planarizing pad which are configured to support a planarizing liquid proximate to the surface of the planarizing pad material during planarization of the microelectronic substrate. Alternatively, the process can form a mold having protrusions that are pressed into the planarizing pad to define the recesses in the pad.

Abstract: Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to a solvent to remove material from one of the first or second portions of the planarizing pad material at a faster rate than removing material from the other of the first and second portions. The process forms a plurality of recesses directly in the surface of the planarizing pad which are configured to support a planarizing liquid proximate to the surface of the planarizing pad material during planarization of the microelectronic substrate. Alternatively, the process can form a mold having protrusions that are pressed into the planarizing pad to define the recesses in the pad.

Abstract: The invention includes methods of treating semiconductor substrates with one or more reactants dispersed in supercritical fluid. A substrate can be provided within a reaction chamber having an interior periphery. The interior periphery can include a bottom region, a top region, and one or more sidewall regions between the bottom and top regions. The reaction chamber can be oriented in a gravitational field such that the field pulls from the top region toward the bottom region. The semiconductor substrate can be attached to one of the regions of the interior periphery other than the bottom region, and thereafter treated within the reaction chamber by exposing the semiconductor substrate to one or more reactants dispersed within a supercritical fluid.

Abstract: Methods for conditioning polishing pads that are to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes, include abrading at least a portion of a polishing surface with a conditioner including abrasive elements formed from a material that is etchable selectively with respect to a material of the polishing pad. At least the conditioned portion of the polishing pad is exposed to at least one chemical to degrade or dissolve any residue or particles without substantially degrading or dissolving a material of the polishing pad. Systems that effect such methods include a conditioner, as well as a support for a polishing pad and at least one movement component for moving the support or a source of the at least one chemical.

Abstract: Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the invention includes pressing a substrate assembly against a planarizing surface of a polishing pad at a pad/substrate interface defined by a surface area of the substrate assembly contacting the planarizing surface. The method continues by moving the substrate assembly and/or the polishing pad with respect to the other to rub at least one of the substrate assembly and the planarizing surface against the other at a relative velocity. As the substrate assembly and polishing pad rub against each other, a parameter indicative of drag force between the substrate assembly and the polishing pad is measured or sensed at periodic intervals.

Abstract: The present invention relates to high-dosage extended-release formulation of gepirone and methods of treating major depression by administering the same to a subject in need thereof. More specifically, the present invention relates to a high-dosage extended-release tablet form of gepirone. The present invention also relates to a method of treating depression in mammals by administering to a subject in need thereof an effective amount the high-dosage extended-release formulation of gepirone in accordance with the present invention.

Abstract: A conditioner includes abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. Any residue or particles of, or from, the abrasive elements that stick to or become embedded in the polishing pad are removed therefrom by exposing the polishing pad to the at least one chemical so as to degrade or dissolve the residue or particles without substantially degrading or dissolving a material of the polishing pad.

Abstract: The cylinder walls of light metal engine blocks are thermally spray coated with a ferrous-based coating including aluminum using an HVOF device. A ferrous-based wire is fed to the HVOF device to locate a tip end of the wire in a high temperature zone of the device. Jet flows of oxygen and gaseous fuel are fed to the high temperature zone and are combusted to generate heat to melt the tip end. The oxygen is oversupplied in relation to the gaseous fuel. The excess oxygen reacts with and burns a fraction of the ferrous-based feed wire in an exothermic reaction to generate substantial supplemental heat to the HVOF device. The molten/combusted metal is sprayed by the device onto the walls of the cylinder by the jet flow of gases.

Abstract: A pharmaceutical composition is provided, which includes: at least one active ingredient selected from the group including adatanserin, a compound having formula I, a compound having formula II, abaperidone, pharmaceutically acceptable salt thereof, prodrug thereof, and a mixture thereof; at least one high or medium viscosity hydroxypropylmethylcellulose (HPMC); at least one high or medium viscosity hydroxyethylcellulose (HEC); wherein the HPMC and HEC are present in a HPMC/HEC weight ratio ranging from 1/0.5 to 1/1.5; wherein adatanserin, abaperidone, and the compounds having formulas (I) and (II) are defined herein.

Abstract: A nozzle assembly for a HVOF thermal metallic spray coating system includes an inner tube, a middle tube and an outer tube which are concentrically arranged about an axis of the nozzle assembly and are spaced to provide annular, concentric gas flow passages for oxygen and gaseous fuel along with a central wire feed passage in an efficient, compact arrangement. A slotted nib and plug are fitted to the discharge end at the assembly and defined, together with the middle tube, an annular premix chamber for the combustible gases, and a plurality of circumferentially spaced mixing slots and a downstream mix end portion of the nib where complete mixing of the gases occurs prior to entry into the combustion chamber provided in an air cap. An annular passage between the air cap and outer tube communicates with a high pressure air source for establishing an envelope of air against the inside surface of the air cap to serve as a protective barrier layer from the atomized metal.

Abstract: Methods for removing material from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes disposing a surfactant-bearing polishing liquid between a doped silicon material of the microfeature workpiece and a polishing pad material. At least one of the workpiece and the polishing pad material is moved relative to the other to simultaneously and uniformly remove at least some of the doped silicon material from portions of the workpiece having different crystalinities and/or different doping characteristics. The surfactant can include a generally non-ionic surfactant having a relatively low concentration in the polishing liquid, for example, from about 0.001% to about 1.0% by weight.

Abstract: A pulsed combustion device includes a support structure and a combustor carousel supported by the support structure and rotating relative thereto about an axis. The carousel has a number of combustion conduits in a circumferential array. Each conduit cyclically receives a charge and discharges combustion products of the charge.

Abstract: An engine piston compression ring designed to reduce the negative effects of ring end butting and reduce blowby. The compression ring has a gap forming an angle with a longitudinal axis of the ring or with a radius drawn from the axis. A relieved portion is provided along the upper or inner side of the ring adjacent one end, depending upon the direction of the gap angle. The relieved portion slopes along the upper or inner side toward the one end where the longitudinal thickness of the ring is smallest.

Abstract: An engine piston compression ring designed to reduce the negative effects of ring end butting and reduce blowby. The compression ring has a gap forming an angle with a longitudinal axis of the ring or with a radius drawn from the axis. A relieved portion is provided along the upper or inner side of the ring adjacent one end, depending upon the direction of the gap angle. The relieved portion slopes along the upper or inner side toward the one end where the longitudinal thickness of the ring is smallest.

Abstract: A nozzle assembly for a HVOF thermal metallic spray coating system includes an inner tube, a middle tube and an outer tube which are concentrically arranged about an axis of the nozzle assembly and are spaced to provide annular, concentric gas flow passages for oxygen and gaseous fuel along with a central wire feed passage in an efficient, compact arrangement. A slided nib and plug are fitted to the discharge end at the assembly and defined, together with the middle tube, an annular premix chamber for the combustible gases, and a plurality of circumferentially spaced mixing slots and a downstream mix end portion of the nib where complete mixing of the gases occurs prior to entry into the combustion chamber provided in an air cap. An annular passage between the air cap and outer tube communicates with a high pressure air source for establishing an envelope of air against the inside surface of the air cap to serve as a protective barrier layer from the atomized metal.

Abstract: The cylinder walls of light metal engine blocks are thermally spray coated with a ferrous-based coating using an HVOF device. A ferrous-based wire is fed to the HVOF device to locate a tip end of the wire in a high temperature zone of the device. Jet flows of oxygen and gaseous fuel are fed to the high temperature zone and are combusted to generate heat to melt the tip end. The oxygen is oversupplied in relation to the gaseous fuel. The excess oxygen reacts with and burns a fraction of the ferrous-based feed wire in an exothermic reaction to generate substantial supplemental heat to the HVOF device. The molten/combusted metal is sprayed by the device onto the walls of the cylinder by the jet flow of gases.