Abstract: A waveguide coupler has a compression region and an expansion region for coupling light between a silicon waveguide and an optical fiber. The compression region receives light from the silicon waveguide and compresses an optical mode of the light. Light is transmitted from the compression region to an expansion region. The expansion region expands the light to have a larger cross section. Light is then transmitted to the optical fiber.

Abstract: A waveguide coupler has a compression region and an expansion region for coupling light between a silicon waveguide and an optical fiber. The compression region receives light from the silicon waveguide and compresses an optical mode of the light. Light is transmitted from the compression region to an expansion region. The expansion region expands the light to have a larger cross section. Light is then transmitted to the optical fiber.

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

Abstract: A waveguide coupler has a compression region and an expansion region for coupling light between a silicon waveguide and an optical fiber. The compression region receives light from the silicon waveguide and compresses an optical mode of the light. Light is transmitted from the compression region to an expansion region. The expansion region expands the light to have a larger cross section. Light is then transmitted to the optical fiber.

Abstract: A waveguide coupler has a compression region and an expansion region for coupling light between a silicon waveguide and an optical fiber. The compression region receives light from the silicon waveguide and compresses an optical mode of the light. Light is transmitted from the compression region to an expansion region. The expansion region expands the light to have a larger cross section. Light is then transmitted to the optical fiber.

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

Abstract: A fiber-optic transmission system includes a transmitter having a designed chirp value. The transmitter has first and second inputs for receiving first and second input signals, respectively, used to produce a modulated output signal. An optical fiber is responsive to the transmitter for receiving the output signal. A circuit asymmetrically drives the first and second input signals so as to change the designed chirp value of the transmitter to another value. Methods of controlling the chirp of a commercially available transmitters are also disclosed. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: A fiber-optic transmission system includes a transmitter having a designed chirp value. The transmitter has first and second inputs for receiving first and second input signals, respectively, used to produce a modulated output signal. An optical fiber is responsive to the transmitter for receiving the output signal. A circuit asymmetrically drives the first and second input signals so as to change the designed chirp value of the transmitter to another value. Methods of controlling the chirp of a commercially available transmitters are also disclosed. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: An integrated laser device includes a pre-distortion circuit. The pre-distortion circuit receives an electrical modulation signal and generates a pre-distorted modulation signal. A laser is integral with the pre-distortion circuit. The laser includes an electrical modulation input that is connected to the output of the pre-distortion circuit. The laser modulates an optical signal with the pre-distorted modulation signal. The pre-distorted modulation signal causes at least some vector cancellation of distortion signals generated when the laser modulates the optical signal.