Patents by Inventor Stephen L. Hanni

Stephen L. Hanni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector with printed wiring board structure
    Patent number: 4109298
    Abstract: An improved connector having a printed wiring board structure and integrally connected to a printed wiring board. The connectors are suitable for use as part of a printed wiring board having a metal substrate. The connectors are finger-like structures, which mate either with other finger-like structures or with apertures in a printed wiring board. Both soldered and solderless connectors are disclosed.
    Type: Grant
    Filed: July 26, 1976
    Date of Patent: August 22, 1978
    Assignee: Texas Instruments Incorporated
    Inventors: Stephen L. Hanni, Dudley B. Johnson
  • Printed wiring board with angled portion and its method of manufacture
    Patent number: 4074419
    Abstract: An improved printed wiring board having a substrate disposed in at least two major planes and having conductors affixed to the substrate traversing between the at least two major planes. Further a method of manufacturing such an improved printed wiring board having a metal substrate is disclosed.
    Type: Grant
    Filed: March 16, 1976
    Date of Patent: February 21, 1978
    Assignee: Texas Instruments Incorporated
    Inventors: Stephen L. Hanni, Dudley B. Johnson
  • Method of fabricating metal printed wiring boards
    Patent number: 3934334
    Abstract: An additive process for producing printed wiring boards is taught. In the process metal substrates having desired hole patterns are powder coated with a dielectric material electrostatically. The dielectric powder coating is then fused on the metal substrate. Next, a continuous film of pre-catalyzed adhesive is applied to all surfaces; then a plating resist is applied to all areas on which copper is not desired. The exposed catalyzed adhesive is then activated and plated in an electroless copper bath.
    Type: Grant
    Filed: April 15, 1974
    Date of Patent: January 27, 1976
    Assignee: Texas Instruments Incorporated
    Inventor: Stephen L. Hanni