Abstract: The invention includes a solution for selectively scaling an integrated circuit (IC) design by: layer, region or cell, or a combination of these. The selective scaling technique can be applied in a feedback loop with the manufacturing system with process and yield feedback, during the life of a design, to increase yield in early processes in such a way that hierarchy is preserved. The invention removes the need to involve designers in improving yield.

Abstract: A method of layout optimization containing parameterized cells includes reading a physical design containing parameterized cells, creating a new version for each of usage of a given parameterized cell. The method optimizes physical design shapes of each new version of the parameterized cell by assigning variables to parameters of the parameterized cell according to a desired objective. Then, the method updates the parameters of each new version of the parameterized cell and replaces each new version of the parameterized cell with an instance of the parameterized cell having updated parameters. The method can optionally adjust physical design shapes based on constraints related to the parameters.

Abstract: An iterative timing analysis is analytically performed before a chip is fabricated, based on a methodology using optical proximity correction techniques for shortening the gate lengths and adjusting metal line widths and proximity distances of critical time sensitive devices. The additional mask is used as a selective trim to form shortened gate lengths or wider metal lines for the selected, predetermined transistors, affecting the threshold voltages and the RC time constants of the selected devices. Marker shapes identify a predetermined subgroup of circuitry that constitutes the devices in the critical timing path. The analysis methodology is repeated as often as needed to improve the timing of the circuit with shortened designed gate lengths and modified RC timing constants until manufacturing limits are reached. A mask is made for the selected critical devices using OPC techniques.

Abstract: Methods of independently migrating a hierarchical design are disclosed. A method for migrating a macro in an integrated circuit comprises: determining an interface strategy between a base cell in the macro and the macro, the base cell including an interface element involved in the interface strategy; migrating the base cell independently with respect to the macro based on the interface strategy; initially scaling the macro; swapping the migrated base cell into the macro; and legalizing content of the initially scaled macro.

Abstract: Mechanisms for ensuring the migratability of circuits into future technologies while minimizing fabrication costs and maintaining or improving power efficiency are provided. A mask layer is introduced to portions of the integrated circuit prior to a stress inducing layer being applied to the integrated circuit. In an exemplary embodiment, a tensile or compressive film is applied to the devices on the integrated circuit chip but is removed from those devices whose operation is to be modified. Thereafter, a tensile or compressive strain layer is applied to the devices whose film was removed. An additional mask layer may then be used to effect a halo or well implant to relax the strain on the devices not being protected by the mask layer. In this way, the current of the non-protected devices is reduced back to its original target design point.

Abstract: A method of layout optimization containing parameterized cells includes reading a physical design containing parameterized cells, creating a new version for each of usage of a given parameterized cell. The method optimizes physical design shapes of each new version of the parameterized cell by assigning variables to parameters of the parameterized cell according to a desired objective. Then, the method updates the parameters of each new version of the parameterized cell and replaces each new version of the parameterized cell with an instance of the parameterized cell having updated parameters. The method can optionally adjust physical design shapes based on constraints related to the parameters.

Abstract: Methods of independently migrating a hierarchical design are disclosed. A method for migrating a macro in an integrated circuit comprises: determining an interface strategy between a base cell in the macro and the macro, the base cell including an interface element involved in the interface strategy; migrating the base cell independently with respect to the macro based on the interface strategy; initially scaling the macro; swapping the migrated base cell into the macro; and legalizing content of the initially scaled macro.

Abstract: Mechanisms for ensuring the migratability of circuits into future technologies while minimizing fabrication costs and maintaining or improving power efficiency are provided. A mask layer is introduced to portions of the integrated circuit prior to a stress inducing layer being applied to the integrated circuit. In an exemplary embodiment, a tensile or compressive film is applied to the devices on the integrated circuit chip but is removed from those devices whose operation is to be modified. Thereafter, a tensile or compressive strain layer is applied to the devices whose film was removed. An additional mask layer may then be used to effect a halo or well implant to relax the strain on the devices not being protected by the mask layer. In this way, the current of the non-protected devices is reduced back to its original target design point.

Abstract: The invention includes a solution for selectively scaling an integrated circuit (IC) design by: layer, region or cell, or a combination of these. The selective scaling technique can be applied in a feedback loop with the manufacturing system with process and yield feedback, during the life of a design, to increase yield in early processes in such a way that hierarchy is preserved. The invention removes the need to involve designers in improving yield.

Abstract: A system and method for ensuring the migratability of circuits into future technologies while minimizing fabrication costs and maintaining or improving power efficiency are provided. A mask layer is introduced to portions of the integrated circuit prior to a stress inducing layer being applied to the integrated circuit. In an exemplary embodiment of the present invention, a tensile or compressive film is applied to the devices on the integrated circuit chip but is removed from those devices whose operation is to be modified. Thereafter, a tensile or compressive strain layer is applied to the devices whose film was removed. An additional mask layer may then be used to effect a halo or well implant to relax the strain on the devices not being protected by the mask layer. In this way, the current of the non-protected devices is reduced back to its original target design point.

Abstract: Methods, systems and program products are disclosed for selectively scaling an integrated circuit (IC) design: by layer, by unit, or by ground rule, or a combination of these. The selective scaling technique can be applied in a feedback loop with the manufacturing system with process and yield feedback, during the life of a design, to increase yield in early processes in such a way that hierarchy is preserved. The invention removes the need to involve designers in improving yield where new technologies such as maskless fabrication are implemented.

Abstract: A processor for performing floating point arithmetic operations is provided that includes a circuit that performs a first floating point arithmetic operation on a set of operands in a first cycle and and a second floating point arithmetic operation on an operand and a result of the first floating point arithmetic operation during a second cycle. A control circuit is provided for, in a third cycle, transferring a result of the second floating operation to the first floating point circuit for a first floating point operation in a next successive cycle while rounding the result of the second floating point operation.

Abstract: A processor for performing floating point arithmetic operations is provided that includes a circuit that performs a first floating point arithmetic operation on a set of operands in a first cycle and a second floating point arithmetic operation on an operand and a result of the first floating point arithmetic operation during a second cycle. A control circuit is provided for, in a third cycle, transferring a result of the second floating operation to the first floating point circuit for a first floating point operation in a next successive cycle while rounding the result of the second floating point operation.