Patents by Inventor Stephen L. Tisdale
Stephen L. Tisdale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6510392Abstract: Methods and apparatus for improved impedance measurements are which allow for shorter delays during recalibration and which eliminate the need to physically disconnect and reconnect test leads after initial calibration has been completed. In particular, an adjustment factor is calculated based on impedances measured during initial calibration and is used to adjust future impedance measurements. Moreover, a plurality of loads having pre-measured impedances are switchably connected to the meter such that re-calibration using said loads may be accomplished without the physical connection or disconnection of test leads. The plurality of loads are preferably incorporated into a test board which also comprises additional test leads and a switching mechanism to alternately connect the various loads and test leads to the meter.Type: GrantFiled: December 28, 2000Date of Patent: January 21, 2003Assignee: Honeywell Advanced Circuits, Inc.Inventors: Yutaka Doi, Stephen L. Tisdale
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Publication number: 20020087277Abstract: Methods and apparatus for improved impedance measurements are which allow for shorter delays during recalibration and which eliminate the need to physically disconnect and reconnect test leads after initial calibration has been completed. In particular, an adjustment factor is calculated based on impedances measured during initial calibration and is used to adjust future impedance measurements. Moreover, a plurality of loads having pre-measured impedances are switchably connected to the meter such that re-calibration using said loads may be accomplished without the physical connection or disconnection of test leads. The plurality of loads are preferably incorporated into a test board which also comprises additional test leads and a switching mechanism to alternately connect the various loads and test leads to the meter.Type: ApplicationFiled: December 28, 2000Publication date: July 4, 2002Inventors: Yutaka Doi, Stephen L. Tisdale
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Patent number: 5919596Abstract: Disclosed is an admixture which is curable to form a crack resistant, photosensitive polycyanurate resist. Also disclosed is a structure for its use and process of making. The resist can be tailored to be either positively or negatively sensitive to actinic radiation. Because of its improved thermal and mechanical properties, the cured resist is suitable for use at high temperature, such as in electronic packaging applications.Type: GrantFiled: February 11, 1997Date of Patent: July 6, 1999Assignee: International Business Machines CorporationInventors: Jeffrey C. Hedrick, Konstantinos Papathomas, Stephen L. Tisdale, Alfred Viehbeck, Jeffrey D. Gelorme, Voya Rista Markovich, Thomas H. Lewis, Stephen Joseph Fuerniss
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Patent number: 5824157Abstract: The invention involves a fluid treatment device to solution or melt impregnate a resin or polymer or any combination thereof into a reinforcement which can be utilized to fabricate composite materials for laminates, circuit boards, structural/aerospace materials, automotive components, etc. The invention offers significant advantages and benefits over existing methods and equipment and allows the impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.Type: GrantFiled: September 6, 1995Date of Patent: October 20, 1998Assignee: International Business Machines CorporationInventors: Elizabeth F. Foster, Jeffrey C. Hedrick, Robert M. Japp, Konstantinos Papathomas, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5725668Abstract: An apparatus for applying a fluid to an outer surface of an elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to the longitudinal axis. The apparatus has a head member having an interior wall cross sectional shape adapted for receiving the cross sectional shape of the elongated work piece. The interior cross sectional shape defines an interior wall of the head member. The head member has an input end and an output end. The interior wall has means for applying the fluid to a surface of said elongated member. The head member has preferable a first part and a second part which are joined by an expandable member.Type: GrantFiled: December 19, 1996Date of Patent: March 10, 1998Assignee: International Business Machines CorporationInventors: Elizabeth F. Foster, Jeffrey C. Hedrick, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5591285Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.Type: GrantFiled: July 24, 1995Date of Patent: January 7, 1997Assignee: International Business Machines Corp.Inventors: Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster, James L. Hedrick, Jr., Jeffrey C. Hedrick, Rodney T. Hodgson, Ashit A. Mehta, Steven E. Molis, Jane M. Shaw, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5571852Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.Type: GrantFiled: June 7, 1995Date of Patent: November 5, 1996Assignee: International Business Machines CorporationInventors: Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster, James L. Hedrick, Jr., Jeffrey C. Hedrick, Rodney T. Hodgson, Ashit A. Mehta, Steven E. Molis, Jane M. Shaw, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5556899Abstract: Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.Type: GrantFiled: November 30, 1994Date of Patent: September 17, 1996Assignee: International Business Machines CorporationInventors: Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster, James L. Hedrick, Jr., Jeffrey C. Hedrick, Rodney T. Hodgson, Ashit A. Mehta, Steven E. Molis, Jane M. Shaw, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5462628Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons.Type: GrantFiled: April 25, 1994Date of Patent: October 31, 1995Assignee: International Business Machines CorporationInventors: Alfred Viehbeck, Martin Goldberg, Stephen L. Tisdale, Stephen L. Buchwalter, Kurt R. Grebe, Caroline A. Kovac, Linda C. Matthew
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Patent number: 5443865Abstract: Substrates are activated for subsequent metallization by contacting the substrate with a electrolyte in which reducing agents which are electrochemically generated in the electrolyte. The reducing agents are sorbed by the substrate which is contacted with a seeding medium to dispose on the substrate seed, preferably palladium seed for subsequent electroless and electrolytic metallization.Type: GrantFiled: March 23, 1992Date of Patent: August 22, 1995Assignee: International Business Machines CorporationInventors: Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5397863Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.Type: GrantFiled: August 13, 1992Date of Patent: March 14, 1995Assignee: International Business Machines CorporationInventors: Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster, James L. Hedrick, Jr., Jeffrey C. Hedrick, Rodney T. Hodgson, Ashit A. Mehta, Steven E. Molis, Jane M. Shaw, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5374454Abstract: A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.Type: GrantFiled: February 4, 1993Date of Patent: December 20, 1994Assignee: International Business Machines IncorporatedInventors: Harry R. Bickford, Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich, Linda C. Matthew, Donald G. McBride, Terrence R. O'Toole, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5318803Abstract: A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.Type: GrantFiled: November 13, 1990Date of Patent: June 7, 1994Assignee: International Business Machines CorporationInventors: Harry R. Bickford, Dennis A. Canfield, Arthur E. Graham, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5242713Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons.Type: GrantFiled: December 23, 1988Date of Patent: September 7, 1993Assignee: International Business Machines CorporationInventors: Alfred Viehbeck, Stephen L. Buchwalter, William A. Donson, John J. Glenning, Martin J. Goldberg, Kurt R. Grebe, Caroline A. Kovac, Linda C. Matthew, Walter P. Pawlowski, Mark J. Schadt, Michael R. Scheuermann, Stephen L. Tisdale
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Patent number: 5203955Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons.Type: GrantFiled: May 24, 1991Date of Patent: April 20, 1993Assignee: International Business Machines CorporationInventors: Aldred Viehbeck, Stephen L. Buchwalter, John J. Glenning, Martin J. Goldberg, Caroline A. Kovac, Linda C. Matthew, Walter P. Pawlowski, Stephen L. Tisdale
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Patent number: 5158645Abstract: A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.Type: GrantFiled: September 3, 1991Date of Patent: October 27, 1992Assignee: International Business Machines, Inc.Inventors: Kathleen L. Covert, Charles C. Emmons, Elizabeth Foster, Richard W. Malek, Voya R. Markovich, Stephen L. Tisdale, Charyl L. Tytran
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Patent number: 5135779Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons.Type: GrantFiled: May 24, 1991Date of Patent: August 4, 1992Assignee: International Business Machines CorporationInventors: Alfred Viehbeck, Stephen L. Buchwalter, Martin J. Goldberg, Caroline A. Kovac, Stephen L. Tisdale
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Patent number: 4904506Abstract: Copper is deposited onto a substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content. The process reduces plating void defects and reduces nodule formation.Type: GrantFiled: January 20, 1987Date of Patent: February 27, 1990Assignee: International Business Machines CorporationInventors: Peter A. Burnett, Dae Y. Jung, Ronald A. Kaschak, Roy H. Magnuson, Robert G. Rickert, Stephen L. Tisdale
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Patent number: 4554182Abstract: Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H.sub.2 SO.sub.4 and a multifunctional cationic copolymer containing at least two available cationic moieties and then activating the surfaces by treating them with a colloidal solution containing palladium chloride, stannous chloride and HCl.The inventive method is particularly useful in processes for producing metal circuits on substrates of glass, thermoplastics and thermosetting resins, such as epoxy cards and boards. The method is also applied in reworking substrates having already undergone copper plating and having been rejected due to failures.Type: GrantFiled: January 31, 1985Date of Patent: November 19, 1985Assignee: International Business Machines CorporationInventors: James R. Bupp, Gary K. Lemon, Voya Markovich, Carlos J. Sambucetti, Stephen L. Tisdale, Donna J. Trevitt
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Patent number: 4534797Abstract: An electroless copper plating bath which is in the take mode is provided by determining the amount in the bath of at least four of the components selected from the group of oxygen, reducing agent, cyanide salt, cupric salt, and complexing agent; solving the equation:R=(CABD)/Ewherin C is the concentration of cupric salt, A is the concentration of reducing agent, B is the concentration of oxygen, D is the concentration of cyanide salt, E is the concentration of complexing agent, and R is a unitless number.The bath is provided with quantities of the above ingredients so that R in the equation is between about 5 and about 15.Type: GrantFiled: January 3, 1984Date of Patent: August 13, 1985Assignee: International Business Machines CorporationInventors: David E. King, Voya Markovich, Carlos J. Sambucetti, Stephen L. Tisdale, Donna J. Trevitt