Abstract: Various embodiments are directed to imaging systems and methods for generating an image of a sub-surface feature of an object through a surface of the object. An illumination array may comprise a plurality of illumination sources positioned around the sub-surface feature of the object. An imaging device may comprise an objective. A computer system may be in communication with the illumination array. The computer system may be programmed to calculate an optimized illumination pattern of the plurality of illumination sources for imaging the sub-surface feature; activate the optimized illumination pattern; and instruct the imaging device to capture an image of the sub-surface feature with the imaging device based on reflected illumination from the optimized illumination pattern.

Abstract: Various embodiments are directed to imaging systems and methods for generating an image of a sub-surface feature of an object through a surface of the object. An illumination array may comprise a plurality of illumination sources positioned around the sub-surface feature of the object. An imaging device may comprise an objective. A computer system may be in communication with the illumination array. The computer system may be programmed to calculate an optimized illumination pattern of the plurality of illumination sources for imaging the sub-surface feature; activate the optimized illumination pattern; and instruct the imaging device to capture an image of the sub-surface feature with the imaging device based on reflected illumination from the optimized illumination pattern.

Abstract: An illumination source may be directed towards a surface of an object comprising subsurface features, wherein the illumination from the source is directed at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface, the portion having an index of refraction that is greater than the index of refraction of a surrounding medium that surrounds the object. An imaging device may be placed with an objective lens. The first angle may be larger than an acceptance angle of the objective lens. In some embodiments, multiple illumination beams may be generated by one or more illumination sources. The beams may be rotated relative to one another about the normal of the surface. Also, in some embodiments, multiple images may be taken with the objective of the imaging device at different positions rotated off of the normal. The multiple images may be combined to generate a composite image.

Abstract: Various embodiments are directed to systems and methods for imaging subsurface features of a semiconductor object comprising a first region having a first doping property and a second region having a second doping property. The semiconductor object may comprise subsurface features and material between a surface of the semiconductor object and the subsurface features. The material may have an index of refraction that is greater than an index of refraction of a surrounding medium in contact with the surface of the semiconductor object. For example, a system may comprise an imaging device comprising an objective. The imaging device may be sensitive to a first wavelength. The system may also comprise an illumination source to emit illumination substantially at the first wavelength. The illumination may be directed towards the surface of the semiconductor object at a first angle relative to a normal of the surface. The first angle is greater than an acceptance angle of the objective of the imaging device.

Abstract: Various embodiments are directed to systems and methods of imaging subsurface features of objects. An illumination source may be directed towards a surface of an object comprising subsurface features at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface that has an index of refraction that is greater than the index of refraction of a surrounding medium. An imaging device may be placed with an objective lens oriented substantially normal to the surface. The first angle may be larger than an acceptance angle of the objective lens.

Abstract: Various embodiments are directed to systems and methods of imaging subsurface features of objects. An illumination source may be directed towards a surface of an object comprising subsurface features at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface that has an index of refraction that is greater than the index of refraction of a surrounding medium. An imaging device may be placed with an objective lens oriented substantially normal to the surface. The first angle may be larger than an acceptance angle of the objective lens.

Abstract: Various embodiments are directed to systems and methods of imaging subsurface features of objects. An illumination source may be directed towards a surface of an object comprising subsurface features at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface that has an index of refraction that is greater than the index of refraction of a surrounding medium. An imaging device may be placed with an objective lens oriented substantially normal to the surface. The first angle may be larger than an acceptance angle of the objective lens.

Abstract: Various embodiments are directed to systems and methods for imaging subsurface features of a semiconductor object comprising a first region having a first doping property and a second region having a second doping property. The semiconductor object may comprise subsurface features and material between a surface of the semiconductor object and the subsurface features. The material may have an index of refraction that is greater than an index of refraction of a surrounding medium in contact with the surface of the semiconductor object. For example, a system may comprise an imaging device comprising an objective. The imaging device may be sensitive to a first wavelength. The system may also comprise an illumination source to emit illumination substantially at the first wavelength. The illumination may be directed towards the surface of the semiconductor object at a first angle relative to a normal of the surface. The first angle is greater than an acceptance angle of the objective of the imaging device.

Abstract: An illumination source may be directed towards a surface of an object comprising subsurface features, wherein the illumination from the source is directed at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface, the portion having an index of refraction that is greater than the index of refraction of a surrounding medium that surrounds the object. An imaging device may be placed with an objective lens. The first angle may be larger than an acceptance angle of the objective lens. In some embodiments, multiple illumination beams may be generated by one or more illumination sources. The beams may be rotated relative to one another about the normal of the surface. Also, in some embodiments, multiple images may be taken with the objective of the imaging device at different positions rotated off of the normal. The multiple images may be combined to generate a composite image.

Abstract: Various embodiments are directed to systems and methods of imaging subsurface features of objects. An illumination source may be directed towards a surface of an object comprising subsurface features at a first angle relative to the normal of the surface. The object may have a portion between the subsurface features and the surface that has an index of refraction that is greater than the index of refraction of a surrounding medium. An imaging device may be placed with an objective lens oriented substantially normal to the surface. The first angle may be larger than an acceptance angle of the objective lens.