Patents by Inventor Stephen Law
Stephen Law has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230120136Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.Type: ApplicationFiled: December 13, 2022Publication date: April 20, 2023Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Patent number: 11552046Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.Type: GrantFiled: March 4, 2020Date of Patent: January 10, 2023Assignee: Apple Inc.Inventors: Andreas Bibi, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Patent number: 11476575Abstract: Disclosed are a calibration system and method for correction of tracking drifts in the output section of a satellite payload and a beamforming network. The disclosed technique exploits characterisation of path gain and phase tracking drifts as deterministic errors that can be measured over spacecraft lifetime without statistical approximations, and thereafter predicted for in-orbit daily temperature variations. Also disclosed is a satellite payload for transmitting test signals to the calibration system.Type: GrantFiled: August 28, 2020Date of Patent: October 18, 2022Assignee: AIRBUS DEFENCE AND SPACE LIMITEDInventors: Esteban Laria, Stephen Laws, Winston Ramsey
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Publication number: 20220209407Abstract: Disclosed are a calibration system and method for correction of tracking drifts in the output section of a satellite payload and a beamforming network. The disclosed technique exploits characterisation of path gain and phase tracking drifts as deterministic errors that can be measured over spacecraft lifetime without statistical approximations, and thereafter predicted for in-orbit daily temperature variations. Also disclosed is a satellite payload for transmitting test signals to the calibration system.Type: ApplicationFiled: August 28, 2020Publication date: June 30, 2022Inventors: Esteban Laria, Stephen Laws, Winston Ramsey
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Publication number: 20200219840Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.Type: ApplicationFiled: March 4, 2020Publication date: July 9, 2020Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Patent number: 10607961Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.Type: GrantFiled: August 30, 2018Date of Patent: March 31, 2020Assignee: Apple Inc.Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Patent number: 10478857Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.Type: GrantFiled: June 20, 2018Date of Patent: November 19, 2019Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
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Publication number: 20190259907Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.Type: ApplicationFiled: April 30, 2019Publication date: August 22, 2019Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Patent number: 10297712Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.Type: GrantFiled: June 23, 2014Date of Patent: May 21, 2019Assignee: Apple Inc.Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Publication number: 20190096846Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.Type: ApplicationFiled: August 30, 2018Publication date: March 28, 2019Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Patent number: 10121864Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.Type: GrantFiled: September 30, 2016Date of Patent: November 6, 2018Assignee: Apple Inc.Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Publication number: 20180297080Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.Type: ApplicationFiled: June 20, 2018Publication date: October 18, 2018Applicant: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
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Patent number: 10022750Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.Type: GrantFiled: June 29, 2015Date of Patent: July 17, 2018Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
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Patent number: 9919342Abstract: An ultrasonic piezoelectric transducer device includes a transducer array consisting of an array of vibrating elements, and a base to which the array of vibrating elements in the transducer array are attached. The base include integrated electrical interconnects for carrying driving signals and sensed signals between the vibrating elements and an external control circuit. The base can be an ASIC wafer that includes integrated circuitry for controlling the driving and processing the sensed signals. The interconnects and control circuits in the base fit substantially within an area below the array of multiple vibrating elements.Type: GrantFiled: June 29, 2015Date of Patent: March 20, 2018Assignee: FUJIFILM Dimatix, Inc.Inventors: Andreas Bibl, Hung-fai Stephen Law, Kevin von Essen, Mats G. Ottosson
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Patent number: 9831383Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.Type: GrantFiled: November 4, 2013Date of Patent: November 28, 2017Assignee: Apple Inc.Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
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Patent number: 9773750Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.Type: GrantFiled: January 24, 2013Date of Patent: September 26, 2017Assignee: Apple Inc.Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu, Hung-Fai Stephen Law
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Patent number: 9620478Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.Type: GrantFiled: February 13, 2012Date of Patent: April 11, 2017Assignee: Apple Inc.Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Publication number: 20170018613Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.Type: ApplicationFiled: September 30, 2016Publication date: January 19, 2017Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Patent number: 9463613Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.Type: GrantFiled: June 17, 2014Date of Patent: October 11, 2016Assignee: Apple Inc.Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Patent number: 9375850Abstract: Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground plane common to a first electrode of the transducer elements to suppress capacitive coupling of signal lines connected to a second electrode of the transducer elements.Type: GrantFiled: February 7, 2013Date of Patent: June 28, 2016Assignee: FUJIFILM DIMATIX, INC.Inventors: Arman Hajati, Dimitre Latev, Deane Gardner, Hung-Fai Stephen Law