Abstract: An extruder includes a receptacle for containing material to be extruded. The extruder further includes a dispersion blade positioned within the receptacle and a nozzle secured to the receptacle. The nozzle defines a first opening positioned within an interior of the receptacle, defines a second opening positioned outside of the receptacle and defines a channel which extends from the first opening through the nozzle to the second opening defining a flow path which extends from the first opening, through the channel and to the second opening. The nozzle extends through a wall of the receptacle and into the interior of the receptacle such that the first opening is positioned spaced apart from the wall.

Abstract: An extruder includes a receptacle for containing material to be extruded. The extruder further includes a dispersion blade positioned within the receptacle and a nozzle secured to the receptacle. The nozzle defines a first opening positioned within an interior of the receptacle, defines a second opening positioned outside of the receptacle and defines a channel which extends from the first opening through the nozzle to the second opening defining a flow path which extends from the first opening, through the channel and to the second opening. The nozzle extends through a wall of the receptacle and into the interior of the receptacle such that the first opening is positioned spaced apart from the wall.

Abstract: An extruder includes a receptacle for containing material to be extruded. The extruder further includes a dispersion blade positioned within the receptacle and a nozzle secured to the receptacle. The nozzle defines a first opening positioned within an interior of the receptacle, defines a second opening positioned outside of the receptacle and defines a channel which extends from the first opening through the nozzle to the second opening defining a flow path which extends from the first opening, through the channel and to the second opening. The nozzle extends through a wall of the receptacle and into the interior of the receptacle such that the first opening is positioned spaced apart from the wall.

Abstract: An automated pipe freeze protection system is disclosed. The system includes tubing, a detector module, and a valve configured to open and circulate unfrozen water through plumbing in the event ambient temperature is detected to be near a freezing point.

Abstract: A chip-packaging composition includes a thermosetting resin and at least one of an N-hetero cyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the chip-packaging composition. A method includes assembly of the chip-packaging composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the chip-packaging composition.

Abstract: In relation to a nut and bolt combination that can fasten together a myriad of objects, one constant has remained the same; the nut must be threaded on to or off of the bolt to facilitate the proper employment of the two complementary devices. Oftentimes this can be a tedious, time consuming exercise. In this invention, a nut, unique bolt and unique washer combination work as one unit to facilitate the speedy removal and reinstatement, respectively, of said nut, bolt and washer from and to any two or more objects meant to be joined together by use of such a device.

Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

Abstract: A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

Abstract: A process of packaging a microelectronic chip includes wafer-level application of a chip-packaging composition that includes a polymer of a bis-maleimide. A process includes wafer-level addition of the chip-packaging compositions that include adding particulate fillers to achieve a coefficient of thermal expansion of about 20 ppm/K. A computing system is also included that uses a microelectronic die that was processed with the bis-maleimide at the wafer level, before singulation.

Abstract: Smart curing by coupling a catalyst to one or more surface(s) of one or more microelectronic element(s) is generally described. In this regard, according to one example embodiment, a catalyst is coupled to one or more surface(s) of one or more microelectronic element(s) to promote polymerization of an adhesive brought in contact with the catalyst.

Abstract: A chip-packaging composition includes a polymer of a bis-maleimide. A process includes formation of the chip-packaging composition including adding particulate fillers to achieve a coefficient of thermal expansion of about 20 ppm/K. A method includes assembly of the chip-packaging composition with a die or a mounting substrate. A computing system is also included that uses the chip-packaging composition.

Abstract: A chip-packaging composition includes a thermosetting resin and at least one of an N-heterocyclic carbene adduct, an imidazole, and a cycloaliphatic amine hardener. The chip-packaging composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the chip-packaging composition. A method includes assembly of the chip-packaging composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the chip-packaging composition.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having surface groups to react with one or more components of a plastic. In some implementations, the dendrimers or hyperbranched polymers have a glass transition temperature of less than an operating temperature of the integrated circuit and form at least a partially separate phase.

Abstract: An embodiment is a cyclic olefin semiconductor package. Further an embodiment is a combination of a cyclic olefin monomer and a ruthenium-based catalyst that is stable at approximately room temperature and humidity for extended storage life and pot life, and that can be screen printed or valve/jet deposited.

Abstract: A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

Abstract: The present invention is related to a linear functional polymer having repeating units A, B and D. Unit A represents —CH2—, unit B represents and unit D represents where R1 represents a polar functional group. There are at least four A units separating each B unit, each D unit, and each B and D unit. The value y represents the total number of B units and is an integer greater than or equal to 1. The total number of D units is represented by h and is an integer greater than or equal to 0. And x represents the total number of A units and is an integer sufficient that the molar fraction of the B and D units in the linear functional polymer is represented by a value j defined by the equation: j = y + h x + y + h ? 0.032 . The present invention is also directed to a method for preparing such linear functional polymers by copolymerizing a first polar substituted monomer and a second non-polar unsubstituted monomer.