Patents by Inventor Stephen Leslie Buchwalter
Stephen Leslie Buchwalter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8541299Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: GrantFiled: May 26, 2010Date of Patent: September 24, 2013Assignee: Ultratech, Inc.Inventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Patent number: 8476773Abstract: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: GrantFiled: May 26, 2010Date of Patent: July 2, 2013Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Patent number: 8242010Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: GrantFiled: May 26, 2010Date of Patent: August 14, 2012Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Publication number: 20100230143Abstract: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: ApplicationFiled: May 26, 2010Publication date: September 16, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Publication number: 20100230474Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: ApplicationFiled: May 26, 2010Publication date: September 16, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Publication number: 20100230475Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: ApplicationFiled: May 26, 2010Publication date: September 16, 2010Applicant: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Patent number: 7786001Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: GrantFiled: April 11, 2007Date of Patent: August 31, 2010Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Patent number: 7776993Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.Type: GrantFiled: June 15, 2005Date of Patent: August 17, 2010Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Claudius Feger, Gareth Hougham, Nancy LaBianca, Hosadurga Shobha
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Publication number: 20090065555Abstract: An electrical structure method of forming. The method includes forming a plurality of individual metallic structures from metallic layer formed over a first substrate. A plurality of vias are formed within a second substrate. The plurality of vias are positioned over and surrounding the plurality of metallic structures. A portion of each via is filled with solder to form solder structure surrounding an exterior surface of each metallic structure. The first substrate is removed from the metallic structures. The metallic structures comprising the solder structures are positioned over a third substrate comprising a plurality of electrically conductive pads. The metallic structures comprising the solder structures are heated to a temperature sufficient to cause the solder to melt and form an electrical and mechanical connection between each metallic structure and an associated electrically conductive pad. The second substrate is removed from the individual metallic structures.Type: ApplicationFiled: September 12, 2007Publication date: March 12, 2009Inventors: Stephen Leslie Buchwalter, Peter A. Gruber, Da-Yuan Shih
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Publication number: 20080251281Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.Type: ApplicationFiled: April 11, 2007Publication date: October 16, 2008Inventors: Stephen Leslie Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih
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Patent number: 7064013Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.Type: GrantFiled: July 1, 2004Date of Patent: June 20, 2006Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
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Patent number: 6919420Abstract: Reworkable thermoset acid-cleavable acetal and ketal based epoxy oligomers can be B-staged into a tack free state. Compositions containing the epoxy oligomers are employed in a reworkable assembly such as a wafer-level underfilled microelectronic package.Type: GrantFiled: December 5, 2002Date of Patent: July 19, 2005Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Claudius Feger, Gareth Hougham, Nancy LaBianca, Hosadurga Shobha
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Publication number: 20040238967Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.Type: ApplicationFiled: July 1, 2004Publication date: December 2, 2004Inventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
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Patent number: 6803256Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.Type: GrantFiled: January 4, 2002Date of Patent: October 12, 2004Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
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Publication number: 20040110010Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled miocroelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.Type: ApplicationFiled: December 5, 2002Publication date: June 10, 2004Inventors: Stephen Leslie Buchwalter, Claudius Feger, Gareth Hougham, Nancy LaBianca, Hosadurga Shobha
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Patent number: 6531343Abstract: A method of encapsulating a circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate by applying an encapsulant adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.Type: GrantFiled: June 5, 2000Date of Patent: March 11, 2003Assignee: International Business Machines CorporationInventors: Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller, Michael Anthony Gaynes, Stephen Leslie Buchwalter
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Publication number: 20020121698Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.Type: ApplicationFiled: January 4, 2002Publication date: September 5, 2002Applicant: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
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Patent number: 6369452Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.Type: GrantFiled: July 27, 1999Date of Patent: April 9, 2002Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
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Patent number: 6326237Abstract: The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a hyperbranched polymer formed by the reaction of a monomer of the formula: (A)nRB, wherein A is a coupling group reactive with B, B is a coupling group reactive with A, n is greater than 1, and R is a group selected from the group consisting of an aromatic group, an aliphatic group, and mixtures thereof Also disclosed is a method of encapsulating a circuit assembly using the encapsulant of the invention.Type: GrantFiled: June 4, 1999Date of Patent: December 4, 2001Assignee: International Business Machines CorporationInventors: Kenneth Raymond Carter, Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller, Michael Anthony Gaynes, Stephen Leslie Buchwalter
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Patent number: 6258899Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent or and an amine promoter.Type: GrantFiled: April 7, 1999Date of Patent: July 10, 2001Assignee: International Business Machines CorporationInventors: Stephen Leslie Buchwalter, Joseph Paul Kuczynski, John Gregory Stephanie