Abstract: Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at least one edge. In this example, the leadframe may further include a plurality of lead fingers having ends extending toward the at least one edge, wherein the ends of ones of adjacent lead fingers are staggered proximate and distal the at least one edge.

Abstract: Provided, in one embodiment, is an integrated circuit (IC) leadframe. In one example, the leadframe includes a paddle, wherein the paddle has a surface configured to accept an IC chip and has at least one edge, the at least one edge having one or more slots located therein. In this example, the leadframe may further include a plurality of lead fingers having ends extending toward the at least one edge, wherein the ends of ones of pairs of adjacent lead fingers extend into corresponding slots in the paddle.

Abstract: A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.

Abstract: In a preferred embodiment, a restraint system is described for restraining a standing occupant in a vehicle such as a plane or helicopter. The restraint system includes a webbing strap that winds and unwinds from a spool assembly. The spool assembly includes a trigger assembly that locks a spool from rotation, a manual release assembly for manually releasing the trigger assembly and lock, and an adjustable payout assembly that determines the maximum length that the webbing strap can be pulled out before stopping (i.e., the number of rotations of the spool). The trigger assembly can trigger the lock assembly from one or more sensors. Further, the trigger assembly can be arranged to automatically unlock after a triggering event, manually unlocked after a triggering event or a combination of the two for different sensors.

Abstract: A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.

Abstract: In a preferred embodiment, a restraint system is described for restraining a standing occupant in a vehicle such as a plane or helicopter. The restraint system includes a webbing strap that winds and unwinds from a spool assembly. The spool assembly includes a trigger assembly that locks a spool from rotation, a manual release assembly for manually releasing the trigger assembly and lock, and an adjustable payout assembly that determines the maximum length that the webbing strap can be pulled out before stopping (i.e., the number of rotations of the spool). The trigger assembly can trigger the lock assembly from one or more sensors. Further, the trigger assembly can be arranged to automatically unlock after a triggering event, manually unlocked after a triggering event or a combination of the two for different sensors.