Abstract: Systems and methods are disclosed for organizing layout data. A layout database is analyzed to determine a statistical distribution of cells within the layout database based on a shape complexity of each cell. Cells with a shape complexity that exceeds a complex threshold may be defined as complex cells, which are examined to find candidate shapes that may be moved to one or more child cells within the complex cell. The layout database is then stored as an output layout database with at least some of these candidate shapes moved to child cells within the complex cells. Simple cells with a shape complexity that is less than a simple threshold may have their layout shapes moved to a parent cell of that simple cell. The layout database may also be partitioned into multiple dispatchable segments, which may be distributed to multiple processing threads for performing additional processes on the database.

Abstract: Systems and methods are disclosed for organizing layout data. A layout database is analyzed to determine a statistical distribution of cells within the database based on the shape complexity of each cell. Cells with a shape complexity that exceeds a complex threshold may be defined as complex cells, which are examined to find candidate shapes that may be moved to one or more child cells within the complex cell. The layout database is then stored as an output layout database with at least some of these candidate shapes moved to child cells within the complex cells. Simple cells with a shape complexity that is less than a simple threshold may have their layout shapes moved to a parent cell of that simple cell. The database may also be partitioned into multiple dispatchable segments, which may be distributed to multiple processing threads for performing additional processes on the database.

Abstract: A method of forming a semiconducting wafer is provided that utilizes fewer processing operations, reduces process variation, and lowers cost as well as production time. The method provided further improves via reliability by permitting vias to be formed with consistent aspect ratios. Devices and method are provided that substantially eliminate four way intersections on semiconductor wafers between conducting elements and supplemental elements. The devices and methods provide a more uniform deposition rate of a subsequent dielectric layer. Four way intersections are removed from both conductive element regions as well as supplemental element regions.

Abstract: A method of forming a semiconducting wafer is provided that utilizes fewer processing operations, reduces process variation, and lowers cost as well as production time. The method provided further improves via reliability by permitting vias to be formed with consistent aspect ratios. Devices and method are provided that substantially eliminate four way intersections on semiconductor wafers between conducting elements and supplemental elements. The devices and methods provide a more uniform deposition rate of a subsequent dielectric layer. Four way intersections are removed from both conductive element regions as well as supplemental element regions.

Abstract: A method of forming a semiconducting wafer is provided that utilizes fewer processing operations, reduces process variation, and lowers cost as well as production time. The method provided further improves via reliability by permitting vias to be formed with consistent aspect ratios. Devices and method are provided that substantially eliminate four way intersections on semiconductor wafers between conducting elements and supplemental elements. The devices and methods provide a more uniform deposition rate of a subsequent dielectric layer. Four way intersections are removed from both conductive element regions as well as supplemental element regions.