Patents by Inventor Stephen M. Phillips

Stephen M. Phillips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedded microelectromechanical systems sensor and related devices and methods
    Patent number: 8610223
    Abstract: Embodiments of embedded MEMS sensors and related methods are described herein. Other embodiments and related methods are also disclosed herein.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: December 17, 2013
    Assignee: Arizona Board of Regents
    Inventors: Narendra V. Lakamraju, Sameer M. Venugopal, Stephen M. Phillips, David R. Allee
  • Embedded Microelectromechanical Systems Sensor and Related Devices and Methods
    Publication number: 20120175714
    Abstract: Embodiments of embedded MEMS sensors and related methods are described herein. Other embodiments and related methods are also disclosed herein.
    Type: Application
    Filed: July 27, 2011
    Publication date: July 12, 2012
    Applicants: Arizona State University
    Inventors: Narendra V. Lakamraju, Sameer M. Venugopal, Stephen M. Phillips, David R. Allee
  • Self-Anchoring MEMS Intrafascicular Neural Electrode
    Publication number: 20100268055
    Abstract: The present invention provides a self anchoring electrode for recording, measuring and/or stimulating nerve activity in nerves and/or nerve fascicles of the peripheral nervous system, and methods for using such a self anchoring electrode.
    Type: Application
    Filed: July 21, 2008
    Publication date: October 21, 2010
    Applicant: Arizona Board of Regents, a Body Corporate Acting for and on Behalf of Arizona State University
    Inventors: Ranu Jung, Stephen M. Phillips, James J. Abbas
  • Multi-layer assemblies with predetermined stress profile and method for producing same
    Patent number: 6610361
    Abstract: Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.
    Type: Grant
    Filed: November 26, 1999
    Date of Patent: August 26, 2003
    Assignee: Case Western Reserve University
    Inventors: Arthur H. Heuer, Harold Kahn, Jie Yang, Stephen M. Phillips
  • Large area polysilicon films with predetermined stress characteristics and method for producing same
    Patent number: 6479166
    Abstract: Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: November 12, 2002
    Assignee: Case Western Reserve University
    Inventors: Arthur H. Heuer, Harold Kahn, Jie Yang, Stephen M. Phillips