Abstract: The present invention is directed to three dimensional weaves composed of wires or yarns that offer the potential for damping not achievable with solid materials, including high temperature damping. Three damping mechanisms have been identified: (1) Internal material damping, (2) Frictional energy dissipation (Coulomb damping), and (3) inertial damping (tuned mass damping). These three damping mechanisms can be optimized by modifying the wire material chemistries (metals, ceramics, polymers, etc.), wire sizes, wire shapes, wire coatings, wire bonding, and wire architecture (by removing certain wires). These have the effect of modifying the lattice and wire stiffnesses, masses, coefficients of friction, and internal material damping. Different materials can be used at different locations in the woven lattice. These design variables can also be modified to tailor mechanical stiffness and strength of the lattice, in addition to damping.

Abstract: The present invention is directed to three dimensional weaves composed of wires or yarns that offer the potential for damping not achievable with solid materials, including high temperature damping. Three damping mechanisms have been identified: (1) Internal material damping, (2) Frictional energy dissipation (Coulomb damping), and (3) inertial damping (tuned mass damping). These three damping mechanisms can be optimized by modifying the wire material chemistries (metals, ceramics, polymers, etc.), wire sizes, wire shapes, wire coatings, wire bonding, and wire architecture (by removing certain wires). These have the effect of modifying the lattice and wire stiffnesses, masses, coefficients of friction, and internal material damping. Different materials can be used at different locations in the woven lattice. These design variables can also be modified to tailor mechanical stiffness and strength of the lattice, in addition to damping.

Abstract: The present invention is directed to devices formed from three-dimensional (3D) structures composed of metallic, ceramic or polymeric wires or bundles and yarns of wires that are either solid or hollow like a tube. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, in some cases using a topology optimization routine that includes the 3D manufacturing constraints. The properties can be optimized in different directions. The 3D structures of the present invention include multiple properties that are optimized for a range of different applications, including heat transfer. The present invention also includes the methods for optimization of the 3D structures as well as methods of use of the 3D structures in heat transfer applications.

Abstract: A graphics processing apparatus includes an output pipeline including a set of memory clients. The graphics processing apparatus also includes a memory controller connected to the output pipeline. The memory controller is configured to retrieve data requested by respective ones of the memory clients from a memory. The graphics processing apparatus further includes a buffering module connected between the memory controller and the output pipeline. The buffering module includes a buffer including a buffering space shared by the memory clients. The buffering module also includes a buffer controller connected to the buffer. The buffer controller is configured to: (1) dynamically assign portions of the buffering space to respective ones of the memory clients; (2) coordinate storage of the data in the assigned portions; and (3) coordinate delivery of the data from the assigned portions to respective ones of the memory clients.

Abstract: Apparatus, system, and method for delivering data to multiple memory clients are described. In one embodiment, a graphics processing apparatus includes an output pipeline including a set of memory clients. The graphics processing apparatus also includes a memory controller connected to the output pipeline. The memory controller is configured to retrieve data requested by respective ones of the set of memory clients from a memory. The graphics processing apparatus further includes a buffering module connected between the memory controller and the output pipeline. The buffering module includes a unitary buffer and a buffer controller connected to the unitary buffer. The buffer controller is configured to coordinate storage of the data in the unitary buffer, and the buffer controller is configured to coordinate delivery of the data from the unitary buffer to respective ones of the set of memory clients.

Abstract: A removable exhaust pipe cover for placement over an exhaust pipe opening of a non-running internal combustion engine for excluding water and debris from entering the pipe. The cover is an elongated tubular member of water repellant material which is preferably flexible to a degree, the flexibility being for allowing constricting and sealing against the pipe when in use, and for compact folded or collapsed storage of the cover when not in use. The tubular cover has a closed top end, an oppositely disposed open bottom end, and an annular sidewall extending between the two ends. The bottom open end of the cover, in at least one embodiment, has a elasticized gathered hem which holds the cover tightly closed about the exhaust pipe with the closed top end and upper portion of the sidewall covering and thus closing the open end of the pipe when installed.