Abstract: A compliant lead clip comprises a single strip of metal bent to form a C-shaped member and an S-shaped member, the two members having a common portion. An integrated circuit chip is inserted into the C-shaped member and soldered thereto after which the lower part of the S-shaped member is soldered to the top surface of a printed circuit board whereby the chip is supported above the printed circuit board. The S-shaped member bends or twists to absorb forces which would otherwise be exerted on the solder joints as a result of warpage of the printed circuit board or temperature changes where the chip carrier and printed circuit board have different thermal coefficients of expansion.