Abstract: A heat exchange assembly is configured to be coupled to a cooling loop for cooling an electronic component of a vehicle. The heat exchange assembly includes a heat exchange plate and a resistive heating element. The heat exchange plate includes a base plate configured to be in thermal communication with the electronic component, and a shell coupled to the base plate such that a cooling chamber is defined between the shell and the base plate. The shell is configured to provide a cooling fluid from the cooling loop to the cooling chamber and return the cooling fluid to the cooling loop. The resistive heating element is disposed on the shell and in thermal communication with the cooling chamber for heating the cooling fluid within the cooling chamber to increase the temperature of the cooling fluid returned to the cooling loop.

Abstract: A thermal management apparatus includes a manifold defining a first manifold flow path for directing a first working fluid and a second manifold flow path for directing a second working fluid, a first heating element in thermal communication with the first manifold flow path for heating the first working fluid, a second heating element operable independent of the first heating element and in thermal communication with the second manifold flow path for heating the second working fluid, and a heat exchanger defining a first heat exchanger flow path in fluid communication with the first manifold flow path and a second heat exchanger flow path in fluid communication with the second manifold flow path. The first heat exchanger flow path and the second heat exchanger flow path are disposed in thermal communication with each other to facilitate heat transfer between the first working fluid and the second working fluid.

Abstract: A heat exchange assembly is configured to be coupled to a cooling loop for cooling an electronic component of a vehicle. The heat exchange assembly includes a heat exchange plate and a resistive heating element. The heat exchange plate includes a base plate configured to be in thermal communication with the electronic component, and a shell coupled to the base plate such that a cooling chamber is defined between the shell and the base plate. The shell is configured to provide a cooling fluid from the cooling loop to the cooling chamber and return the cooling fluid to the cooling loop. The resistive heating element is disposed on the shell and in thermal communication with the cooling chamber for heating the cooling fluid within the cooling chamber to increase the temperature of the cooling fluid returned to the cooling loop.