Patents by Inventor Stephen N. Siu

Stephen N. Siu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insert-molded leadframe to optimize interface between powertrain and driver board
    Patent number: 6281579
    Abstract: An insert-molded leadframe having wire bonding posts formed on an inner portion, device pins formed on an outer portion, and a central portion connecting between the inner portion and the outer portion. Plastic encases the central portion of the conductive leadframe, such that the bonding posts and the device pins are exposed at inner and outer edges, respectively, of the plastic casing. The bonding posts and the device pins are disposed substantially perpendicular to one another. The conductive leadframe is formed with the bonding posts in a first plane and the device pins in a second plane, the first and second planes being substantially mutually parallel. The conductive leadframe then is encased in plastic by injection molding to form the insert-molded leadframe of the invention.
    Type: Grant
    Filed: February 13, 1998
    Date of Patent: August 28, 2001
    Assignee: International Rectifier Corporation
    Inventor: Stephen N. Siu