Patents by Inventor Stephen O'Brien

Stephen O'Brien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125872
    Abstract: The present disclosure provides a magnetoresistive (xMR) sensor that has enhanced immunity to the presence of a magnetic cross field by using a combination of differential biasing on the sensing layers of the sensing elements, sensing elements having different sensitivities, and different reference magnetization directions. The xMR sensor comprises two or more arrays of sensing elements, wherein each array comprises a plurality of sensing elements. The sensing elements within each array may be arranged in pairs, wherein the sensor elements within each pair have sensing layers that are magnetically biased in antiparallel directions. The sensing elements within each array are also provided with different respective sensitivities. The sensing elements having the lowest sensitivity are provided with a reference layer magnetised in a first direction, and the sensing elements in the remaining arrays are provided with a reference layer magnetised in a direction that is antiparallel to the first direction.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 18, 2024
    Inventors: Fernando Franco, Jan Kubik, Jochen Schmitt, Stephen O'Brien
  • Publication number: 20240122615
    Abstract: A method for removing one or more objects or materials from a body lumen includes delivering a tube and an expandable device to the body lumen to a position proximal to the one or more objects or materials. The expandable device is positioned with a lumen of the tube, and the expandable device includes a lumen extending from a distal portion to a proximal portion. The method further includes proximally retracting the tube such that the expandable device remains in the position proximal to the one or more objects or materials, distally advancing the expandable device such that the distal portion of the expandable device at least partially surrounds the one or more objects or materials, at least partially closing a distal end of the expandable device, and moving the expandable device proximally to remove the expandable device and the one or more objects or materials from the lumen.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 18, 2024
    Applicant: Boston Scientific Scimed, Inc.
    Inventors: Enda CONNAUGHTON, Anthony O'BRIEN, Aiden FLANAGAN, Charlene DEANE, Michael HUGHES, Richard CRAWFORD, Martin Lawrence FAWDRY, Stephen McCOOEY
  • Patent number: 11953567
    Abstract: The present disclosure provides a magnetic multi-turn sensor comprising a continuous coil of magnetoresistive elements and a method of manufacturing said sensor. The continuous coil is formed on a substrate such as a silicon wafer that has been fabricated so as to form a trench and bridge arrangement that enables the inner and outer spiral to be connected without interfering with the magnetoresistive elements of the spiral winding in between. Once the substrate has been fabricated with the trench and bridge arrangement, a film of the magnetoresistive material can be deposited to form a continuous coil on the surface of the substrate, wherein a portion of the coil is formed in the trench and a portion of the coil is formed on the bridge.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: April 9, 2024
    Assignee: Analog Devices International Unlimited Company
    Inventors: Peter Meehan, Stephen O'Brien, Jochen Schmitt, Michael W. Judy, Enno Lage
  • Publication number: 20240105716
    Abstract: Integrated circuit structures having uniform grid metal gate and trench contact cut, and methods of fabricating integrated circuit structures having uniform grid metal gate and trench contact cut, are described. For example, an integrated circuit structure includes a vertical stack of horizontal nanowires. A gate electrode is over the vertical stack of horizontal nanowires. A conductive trench contact is adjacent to the gate electrode. A dielectric sidewall spacer is between the gate electrode and the conductive trench contact. A first dielectric cut plug structure extends through the gate electrode, through the dielectric sidewall spacer, and through the conductive trench contact. A second dielectric cut plug structure extends through the gate electrode, through the dielectric sidewall spacer, and through the conductive trench contact, the second dielectric cut plug structure laterally spaced apart from and parallel with the first dielectric cut plug structure.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Inventors: Leonard P. GULER, Sukru YEMENICIOGLU, Mohit K. HARAN, Stephen M. CEA, Charles H. WALLACE, Tahir GHANI, Shengsi LIU, Saurabh ACHARYA, Thomas O'BRIEN, Nidhi KHANDELWAL, Marie T. CONTE, Prabhjot LUTHRA
  • Publication number: 20240060796
    Abstract: A magnetic sensor package comprising a magnetic multi-turn sensor die and a magnetic single turn sensor die, in which both sensor dies are packaged on the same lead frame. A method of manufacturing the magnetic sensor package is also provided. A magnetic sensor system comprising a rotating magnet and the magnetic sensor package, where the sensor package is arranged so that both sensor dies sit within a homogenous magnetic field, thereby ensuring that the output signal of each sensor is not corrupted by any stray fields.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 22, 2024
    Inventors: Aude Richard, Michael Mueller-Aulmann, Peter James Tonge, Monsoon Dutt, Jan Kubik, John O'Dowd, Enda Joseph Nicholl, Stephen O'Brien, Jochen Schmitt, Robert Guyol, Christian Nau, Colin P. Giles, Brian O'Mara, Wenmei Wang
  • Patent number: 11798741
    Abstract: Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: October 24, 2023
    Assignee: Analog Devices International Unlimited Company
    Inventors: Sombel Diaham, Paul Lambkin, Bernard Patrick Stenson, Patrick M. McGuinness, Laurence B. O'Sullivan, Stephen O'Brien
  • Patent number: 11761793
    Abstract: A magnetic sensor package comprising a magnetic multi-turn sensor die and a magnetic single turn sensor die, in which both sensor dies are packaged on the same lead frame. A method of manufacturing the magnetic sensor package is also provided. A magnetic sensor system comprising a rotating magnet and the magnetic sensor package, where the sensor package is arranged so that both sensor dies sit within a homogenous magnetic field, thereby ensuring that the output signal of each sensor is not corrupted by any stray fields.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: September 19, 2023
    Assignee: Analog Devices International Unlimited Company
    Inventors: Aude Richard, Michael Mueller-Aulmann, Peter James Tonge, Monsoon Dutt, Jan Kubik, John O'Dowd, Enda Joseph Nicholl, Stephen O'Brien, Jochen Schmitt, Robert Guyol, Christian Nau, Colin P. Giles, Brian O'Mara, Wenmei Wang
  • Publication number: 20230280330
    Abstract: Embodiments of the disclosure provide various nanogap sensor designs (e.g., horizontal nanogap sensors, vertical nanogap sensors, arrays of multiple nanogap sensors, various arrangements for making electrical connections to the electrodes of nanogap sensors, etc.), as well as various methods which may be used to fabricate at least some of the proposed sensors. The nanogap sensors proposed herein may operate as molecular sensors to help identify chemical species through electrical measurements using at least a pair of electrodes separated by a nanogap.
    Type: Application
    Filed: April 28, 2023
    Publication date: September 7, 2023
    Inventors: Christophe ANTOINE, Himanshu JAIN, Matthew Thomas CANTY, Christina B. MCLOUGHLIN, Daniel Joseph LUCEY, Sinead Maire MCDERMOTT, Stephen O'BRIEN, Bernard STENSON, Shane GEARY, William Allan LANE, Michael COLN, Mark Daniel de Leon ALEA
  • Patent number: 11740226
    Abstract: Embodiments of the disclosure provide various nanogap sensor designs (e.g., horizontal nanogap sensors, vertical nanogap sensors, arrays of multiple nanogap sensors, various arrangements for making electrical connections to the electrodes of nanogap sensors, etc.), as well as various methods which may be used to fabricate at least some of the proposed sensors. The nanogap sensors proposed herein may operate as molecular sensors to help identify chemical species through electrical measurements using at least a pair of electrodes separated by a nanogap.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: August 29, 2023
    Assignee: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
    Inventors: Christophe Antoine, Himanshu Jain, Matthew Thomas Canty, Christina B. McLoughlin, Daniel Joseph Lucey, Sinead Maire McDermott, Stephen O'Brien, Bernard Stenson, Shane Geary, William Allan Lane, Michael Coln, Mark De Leon Alea
  • Publication number: 20230083839
    Abstract: Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 16, 2023
    Applicant: Analog Devices International Unlimited Company
    Inventors: Sombel Diaham, Paul Lambkin, Bernard Patrick Stenson, Patrick M. McGuinness, Laurence B. O'Sullivan, Stephen O'Brien
  • Publication number: 20220392684
    Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
    Type: Application
    Filed: August 17, 2022
    Publication date: December 8, 2022
    Inventors: Paul Lambkin, Patrick J. Murphy, Bernard Patrick Stenson, Laurence B. O'Sullivan, Stephen O'Brien, Shane Geary, Baoxing Chen, Sombel Diaham
  • Patent number: 11476045
    Abstract: Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: October 18, 2022
    Assignee: Analog Devices International Unlimited Company
    Inventors: Sombel Diaham, Paul Lambkin, Bernard Patrick Stenson, Patrick M. McGuinness, Laurence B. O'Sullivan, Stephen O'Brien
  • Patent number: 11450469
    Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: September 20, 2022
    Inventors: Paul Lambkin, Patrick J. Murphy, Bernard Patrick Stenson, Laurence B. O'Sullivan, Stephen O'Brien, Shane Geary, Baoxing Chen, Sombel Diaham
  • Publication number: 20220208537
    Abstract: An aperture plate assembly for an analytical instrument comprises a first sub-assembly comprising an aperture plate and a second sub-assembly comprising a guide. The first sub-assembly is configured to be attached to the second sub-assembly such that the aperture plate is positioned in a first position relative to the second sub-assembly. The first sub-assembly and the second sub-assembly are configured such that when the first sub-assembly is engaged by the guide, the aperture plate can be moved into the first position and the first sub-assembly can be attached to the second sub-assembly.
    Type: Application
    Filed: May 13, 2020
    Publication date: June 30, 2022
    Applicant: Micromass UK Limited
    Inventors: Edward Scott, Peter Kerr, Stephen O 'Brien
  • Patent number: 11349714
    Abstract: Automatically providing CLI commands for configuring devices is provided. A set of CLI commands for configuring a device on a network is retrieved from a database using an artificial intelligence component based on model and operating system version of the device. The set of CLI commands for configuring the device is displayed within a summary window of a cognitive CLI. The set of CLI commands entered by a user while configuring the device is verified in real time on a CLI of the cognitive CLI using the artificial intelligence component.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: May 31, 2022
    Assignee: Kyndryl, Inc.
    Inventors: Pravin Bernard Phadte, Nedin Ametovski, Stephen O'Brien, Saritha Route, Francesco Perillo
  • Patent number: 11342170
    Abstract: An apparatus for performing ambient ionization mass and/or ion mobility spectrometry is disclosed. The apparatus comprises a substantially cylindrical, tubular, rod-shaped, coil-shaped, helical or spiral-shaped collision assembly; and a first device arranged and adapted to direct analyte, smoke, fumes, liquid, gas, surgical smoke, aerosol or vapor onto said collision assembly.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: May 24, 2022
    Assignee: Micromass UK Limited
    Inventors: Tamas Karancsi, Daniel Simon, Lajos Godorhazy, Daniel Szalay, Steven Derek Pringle, Emrys Jones, Ian Trivett, Stephen O'Brien, Anthony Hesse, Matt Henderson, Alvin Chua, Zoltan Takats
  • Patent number: 11295942
    Abstract: An apparatus for performing ambient ionization mass and/or ion mobility spectrometry is disclosed. The apparatus comprises a substantially cylindrical, tubular, rod-shaped, coil-shaped, helical or spiral-shaped collision assembly; and a first device arranged and adapted to direct analyte, smoke, fumes, liquid, gas, surgical smoke, aerosol or vapor onto said collision assembly.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: April 5, 2022
    Assignee: Micromass UK Limited
    Inventors: Tamas Karancsi, Daniel Simon, Lajos Godorhazy, Daniel Szalay, Steven Derek Pringle, Emrys Jones, Ian Trivett, Stephen O'Brien, Anthony Hesse, Matt Henderson, Alvin Chua, Zoltan Takats
  • Publication number: 20220075010
    Abstract: The present disclosure provides a magnetic multi-turn sensor comprising a continuous coil of magnetoresistive elements and a method of manufacturing said sensor. The continuous coil is formed on a substrate such as a silicon wafer that has been fabricated so as to form a trench and bridge arrangement that enables the inner and outer spiral to be connected without interfering with the magnetoresistive elements of the spiral winding in between. Once the substrate has been fabricated with the trench and bridge arrangement, a film of the magnetoresistive material can be deposited to form a continuous coil on the surface of the substrate, wherein a portion of the coil is formed in the trench and a portion of the coil is formed on the bridge.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 10, 2022
    Inventors: Peter Meehan, Stephen O'Brien, Jochen Schmitt, Michael W. Judy, Enno Lage
  • Patent number: D1023214
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: April 16, 2024
    Assignee: BRAVO COMPANY MFG, INC.
    Inventors: Eric Stephen Kincel, Jeffrey James O'Brien
  • Patent number: D1025273
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: April 30, 2024
    Assignee: BRAVO COMPANY MFG, INC.
    Inventors: Eric Stephen Kincel, Jeffrey James O'Brien