Abstract: The present disclosure relates to methods for treating Lupus Nephritis (LN) using an anti-BAFFR antibody or binding fragment thereof, e.g., ianalumab. Also disclosed herein are anti-BAFFR antibodies or binding fragments thereof, e.g., ianalumab, for treating LN patients, as well as medicaments, dosing regimens, pharmaceutical formulations, dosage forms, and kits for use in the disclosed uses and methods.

Abstract: The present disclosure relates to methods for treating Systemic Lupus Erythematosus (SLE) using an anti-BAFFR antibody or binding fragment thereof, e.g., ianalumab. Also disclosed herein are anti-BAFFR antibodies or binding fragments thereof, e.g., ianalumab, for treating SLE patients, as well as medicaments, dosing regimens, pharmaceutical formulations, dosage forms, and kits for use in the disclosed uses and methods.

Abstract: Methods of forming a mirror by bonding a faceplate to a core structure using adhesive formulations that include fused silica particles having diameters that range between 1 to 60 micrometers with an average diameter of the silica particles being between 8 to 10 micrometers. The adhesive formulation further includes an activator including 25 to 50 weight % sodium silicate, 25 to 50 weight % sodium hydroxide and a liquid. The fused silica particles constitute 70 to 80 weight % of the adhesive formulation and the activator constitute 20 to 30 weight % of the adhesive formulation.

Abstract: Methods of forming a mirror by bonding a faceplate to a core structure using adhesive formulations that include: (1) a binder comprising 40 to 60 weight % monoaluminum phosphate and 40 to 60 weight % water, the binder constituting 25 to 35 weight % of the adhesive formulation and, (2) a composition that includes a first set of particles having a coefficient of thermal expansion equal to or less than 0.05 ppm/° C. and diameters between 1 to 60 micrometers and a second set of particles having a coefficient of thermal expansion equal to or less than 0.05 ppm/° C. and diameters between 0.05 to 1 micrometers, the first set of particles constituting 80 to 85 weight % of the composition, the second set of particles constituting 15 to 20 weight % of the composition; the composition constituting 65 to 75 weigh % of the adhesive formulation.

Abstract: Methods of forming a mirror by bonding a faceplate to a core structure using adhesive formulations that include: (1) a binder comprising 40 to 60 weight % monoaluminum phosphate and 40 to 60 weight % water, the binder constituting 25 to 35 weight % of the adhesive formulation and, (2) a composition that includes a first set of particles having a coefficient of thermal expansion equal to or less than 0.05 ppm/° C. and diameters between 1 to 60 micrometers and a second set of particles having a coefficient of thermal expansion equal to or less than 0.05 ppm/° C. and diameters between 0.05 to 1 micrometers, the first set of particles constituting 80 to 85 weight % of the composition, the second set of particles constituting 15 to 20 weight % of the composition; the composition constituting 65 to 75 weigh % of the adhesive formulation.

Abstract: The present disclosure relates to methods for treating Sjögren's Syndrome disease using therapeutically effective doses of anti-BAFFR antibody, such as ianalumab.

Abstract: In various embodiments a capture surface for capturing high velocity and hypervelocity dust and ice particles is provided. In certain embodiments the capture surface is comprised of a soft metal that is chosen to optimize particle capture efficiency, to minimize thermal degradation of chemicals and biochemical in the particles, and to present the captured particles to an analyzer for chemical and biochemical analysis of the particles and their contents. In various embodiments capture chambers comprising one or more such capture surfaces are provided as well as methods of use thereof.

Abstract: A user-friendly crane mat carrier is provided for conveniently transporting, storing and supporting crane mats, pads and other items. The economical light weight crane mat assembly can comprise a frame assembly with a main load-supporting bar, crossbars and perimeter bars. The special crane mat carrier can be easily connected to a crane, such as with a drawbar fixture, securing plate and locking plate. A hanger assembly with a suspension bar can be provided to hang the crane mat carrier. A latch mechanism can also be provided to securely lock the crane mat carrier.

Abstract: An inverter for driving a motor includes one or more power stages for producing one or more power signals for energizing the motor, each power stage including first and second III-nitride based bi-directional switching devices connected in series between a DC voltage bus and ground.

Abstract: An inverter for driving a motor includes one or more power stages for producing one or more power signals for energizing the motor, each power stage including first and second III-nitride based bi-directional switching devices connected in series between a DC voltage bus and ground.

Abstract: An inverter for driving a motor includes one or more power stages for producing one or more power signals for energizing the motor, each power stage including first and second III-nitride based bi-directional switching devices connected in series between a DC voltage bus and ground.

Abstract: A copackaged electronic device comprises a diode device having an anode coupled to a drain electrode of a switching device and a cathode capable of being coupled to an external circuit. The switching device may be controlled by an integrated circuit mounted on a source electrode of the switching device and electrically connected such that the integrated circuit is capable of controlling switching of the switching device. For example, the device is used in a power factor correction circuit. The diode device comprises at least one inverted diode having a solderable anode and a wire-bondable cathode.

Abstract: An inverter for driving a motor includes one or more power stages for producing one or more power signals for energizing the motor, each power stage including first and second III-nitride based bi-directional switching devices connected in series between a DC voltage bus and ground.

Abstract: A low profile semiconductor device package includes a lead frame with terminal leads and two die pads for receiving at least two semiconductor die that are interconnected to form a circuit. A further low profile semiconductor device package includes a lead frame with two die pads for receiving at least two semiconductor die that are interconnected to form a circuit and also has a reduced height through removal of a mounting tab. An example of such device packages is a package that includes first and second MOSFET die, each connected to a respective die pad. The source of one MOSFET is connected to the drain of the other MOSFET, thereby forming a low profile device package that provides a half-bridge circuit. Other example device packages include different arrangements of two interconnected MOSFET die, two interconnected IGBTs, or a combination of a MOSFET die and a diode.

Abstract: An eductor apparatus having an air gap and a venturi, a bypass channel and a spray protection device in the form of a deformable porous body to prevent splash back produced at the inlet to the venturi from escaping through the air gap. The spray protection device may also function to absorb the energy of a misaligned water jet and provide an emergency flow path.

Abstract: A copackaged electronic device comprises a diode device having an anode coupled to a drain electrode of a switching device and a cathode capable of being coupled to an external circuit. The switching device may be controlled by an integrated circuit mounted on a source electrode of the switching device and electrically connected such that the integrated circuit is capable of controlling switching of the switching device. For example, the device is used in a power factor correction circuit. The diode device comprises at least one inverted diode having a solderable anode and a wire-bondable cathode.

Abstract: A copackaged electronic device comprises a diode device having an anode coupled to a drain electrode of a switching device and a cathode capable of being coupled to an external circuit. The switching device may be controlled by an integrated circuit mounted on a source electrode of the switching device and electrically connected such that the integrated circuit is capable of controlling switching of the switching device. For example, the device is used in a power factor correction circuit. The diode device comprises at least one inverted diode having a solderable anode and a wire-bondable cathode.

Abstract: An eductor having an air gap, a venturi structure, and a non-return valve located in the air gap. The non-return valve is removable and allows the eductor to be operated as an air gap eductor or a non-return valve eductor. A non-return valve cartridge for installing in to the air gap of an air gap eductor, so that the eductor can be operated as a non-return valve eductor. A method of retrofitting a non-return valve in an air gap eductor.