Abstract: Conductor wires are laid in parallel, one between a respectively associated pair of the coils of a helically wound coil spring while the coils are separated. Thereafter, the coils are moved together so that the conductor wires are pinched between them. One end of each of the wires is fluxed and then tinned with solder in dipping steps. Subsequently, the conductor wires are disposed in respectively associated ones of a series of parallel grooves formed in a conductor holder. The grooves are directed toward cavities in which elements to which the wires are to be bonded are suspended. The conductors are urged into engagement with those elements and hot air is made to flow into the cavity where the solder tinning is rendered molten whereby solder bonding is effected when the supply of hot air is terminated. The process is facilitated by the use of stops in conjunction with a coiled spring such that the conductor wires have their ends arranged in a common line prior to dipping and tinning.