Abstract: A bond pad upon which a wirebond interconnection is formed, consisting of a first bond pad layer formed on a chip, and a second bond pad layer formed on the first bond pad layer, wherein the first bond pad layer is more resistant to removal than the second bond pad layer during probe testing, and the first bond pad layer increases resistance to interconnection failure during mechanical testing.

Abstract: Representative embodiments provide for a computer including a program code configured to cause a processor to invert and thereafter calibrate first and second data sets, subtract the inverted second data set from the inverted first data set to derive a time-lapse data set, calculate a model including a plurality of parametric values, sort the plurality of parametric values into a plurality of bins, select, map and calibrate a plurality of optimal parametric values from the plurality of bins, and plot the plurality of calibrated optimal parametric values to represent at least one physical characteristic of a subterranean reservoir of hydrocarbons. The method includes deriving a time-lapse data set from a first seismic data set and a second seismic data set, deriving a model, sorting the plurality of values into bins, selecting, mapping and calibrating a plurality of optimal values from the bins, and plotting the calibrated values.