Patents by Inventor Stephen P. Neisen

Stephen P. Neisen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11222664
    Abstract: A server box embodiment is disclosed that generally comprises an array of dummy HDDs that share a common set of universal disk drive components in a master components module, or power module. Each dummy HDDs is constructed without expensive onboard chipsets that control the normal functionality of a standard HDD. By sharing expensive chipsets in a master components module (power module) money can be saved in building and selling the dummy HDD server. Embodiments envision a power module possessing the needed chipset functionality that is missing in a dummy HDD. The power module can be made to move from dummy HDD to dummy HDD supplying the necessary chipset in a shared manner when data is being stored or retrieved for client or end-user.
    Type: Grant
    Filed: March 21, 2020
    Date of Patent: January 11, 2022
    Assignee: Spectra Logic Corporation
    Inventors: Nicholas Aldo Nespeca, Jon Benson, Stephen P. Neisen, Matt John Ninesling
  • Patent number: 11114126
    Abstract: A server box embodiment is disclosed that generally comprises an array of dummy HDDs that share a common set of universal disk drive components in a master components module, or power module. Each dummy HDDs is constructed without expensive onboard chipsets that control the normal functionality of a standard HDD. By sharing expensive chipsets in a master components module (power module) money can be saved in building and selling the dummy HDD server. Embodiments envision a power module possessing the needed chipset functionality that is missing in a dummy HDD. The power module can be made to move from dummy HDD to dummy HDD supplying the necessary chipset in a shared manner when data is being stored or retrieved for client or end-user.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: September 7, 2021
    Assignee: Spectra Logic Corporation
    Inventors: Nicholas Aldo Nespeca, Jon Benson, Stephen P. Neisen, Matt John Ninesling
  • Patent number: 10943617
    Abstract: A server box embodiment is disclosed that generally comprises an array of dummy HDDs that share a common set of universal disk drive components in a master components module, or power module. Each dummy HDDs is constructed without expensive onboard chipsets that control the normal functionality of a standard HDD. By sharing expensive chipsets in a master components module (power module) money can be saved in building and selling the dummy HDD server. Embodiments envision a power module possessing the needed chipset functionality that is missing in a dummy HDD. The power module can be made to move from dummy HDD to dummy HDD supplying the necessary chipset in a shared manner when data is being stored or retrieved for client or end-user.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: March 9, 2021
    Assignee: Spectra Logic Corporation
    Inventors: Nicholas Aldo Nespeca, Jon Benson, Stephen P. Neisen, Matt John Ninesling
  • Publication number: 20200293338
    Abstract: A server box embodiment is disclosed that generally comprises an array of dummy HDDs that share a common set of universal disk drive components in a master components module, or power module. Each dummy HDDs is constructed without expensive onboard chipsets that control the normal functionality of a standard HDD. By sharing expensive chipsets in a master components module (power module) money can be saved in building and selling the dummy HDD server. Embodiments envision a power module possessing the needed chipset functionality that is missing in a dummy HDD. The power module can be made to move from dummy HDD to dummy HDD supplying the necessary chipset in a shared manner when data is being stored or retrieved for client or end-user.
    Type: Application
    Filed: March 16, 2020
    Publication date: September 17, 2020
    Inventors: Nicholas Aldo Nespeca, Jon Benson, Stephen P. Neisen, Matt John Ninesling
  • Publication number: 20200290822
    Abstract: A server box embodiment is disclosed that generally comprises an array of dummy HDDs that share a common set of universal disk drive components in a master components module, or power module. Each dummy HDDs is constructed without expensive onboard chipsets that control the normal functionality of a standard HDD. By sharing expensive chipsets in a master components module (power module) money can be saved in building and selling the dummy HDD server. Embodiments envision a power module possessing the needed chipset functionality that is missing in a dummy HDD. The power module can be made to move from dummy HDD to dummy HDD supplying the necessary chipset in a shared manner when data is being stored or retrieved for client or end-user.
    Type: Application
    Filed: March 25, 2020
    Publication date: September 17, 2020
    Inventors: Nicholas Aldo Nespeca, Jon Benson, Stephen P. Neisen, Matt John Ninesling
  • Publication number: 20200294545
    Abstract: A server box embodiment is disclosed that generally comprises an array of dummy HDDs that share a common set of universal disk drive components in a master components module, or power module. Each dummy HDDs is constructed without expensive onboard chipsets that control the normal functionality of a standard HDD. By sharing expensive chipsets in a master components module (power module) money can be saved in building and selling the dummy HDD server. Embodiments envision a power module possessing the needed chipset functionality that is missing in a dummy HDD. The power module can be made to move from dummy HDD to dummy HDD supplying the necessary chipset in a shared manner when data is being stored or retrieved for client or end-user.
    Type: Application
    Filed: March 21, 2020
    Publication date: September 17, 2020
    Inventors: Nicholas Aldo Nespeca, Jon Benson, Stephen P. Neisen, Matt John Ninesling
  • Patent number: 5615735
    Abstract: An improved heat sink assembly apparatus and method of attachment that includes a heat sink with extruded fins, an integrated circuit package, a printed circuit board and a clamp. The printed circuit board is manufactured with L-shaped holes that correspond to opposing corners of the integrated circuit package and the distance between two notched feet on the clamp. To assemble, the integrated circuit package is mounted to the printed circuit board, the heat sink is mounted to a top surface of the integrated circuit package, the clamp is mounted between extruded fins on the heat sink, and then the feet of the clamp are locked into the L-shaped holes on the printed circuit board.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: April 1, 1997
    Assignee: Hewlett-Packard Co.
    Inventors: Stuart Yoshida, Rex Seader, Stephen P. Neisen