Abstract: A clear or colorless coating that is free of yellow discoloration, and a method for the production thereof, utilizing a pyrazole compound as a blocking agent for the blocked polyisocyanate employed in the coating composition.

Abstract: This invention relates to a process for coating a substrate which comprises contacting the substrate with a low volatility organic (so-called "low VOC") coating composition having a viscosity as measured by ZAHN cup 2 of less than about 200 seconds and consisting essentially of at least one polyisocyanate prepolymer which is the reaction product of a polyisocyanate with an active hydrogen-containing compound selected from the group consisting of monoahls, polyols, imines, oxazolidines, and combinations thereof, a solvent in an amount of between 0% and 45% by weight based upon the amount of said polyisocyanate in said composition, and a tertiary amine catalyst, said composition being essentially free of any volatile mono- and di-isocyanates, and said composition being moisture curable upon exposure to atmospheric moisture. Also claimed is the coating composition itself.

Abstract: This invention relates to a process for coating a substrate which comprises contacting the substrate with a low volatility organic (so-called "low VOC") coating composition having a viscosity as measured by ZAHN cup 2 of less than about 200 seconds and consisting essentially of at least one polyisocyanate prepolymer which is the reaction product of a polyisocyanate with an active hydrogen-containing compound selected from the group consisting of monoahls, polyols, imines, oxazolidines, and combinations thereof, a solvent in an amount of between 0% and 45% by weight based upon the amount of said polyisocyanate in said composition, and a tertiary amine catalyst, said composition being essentially free of any volatile mono- and di-isocyanates, and said composition being moisture curable upon exposure to atmospheric moisture. Also claimed is the coating composition itself.

Abstract: A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.