Abstract: A computing apparatus including a printed circuit board (PCB) including a first central processing unit (CPU) socket and additional CPU socket(s); a CPU coupled to the first CPU socket; a base interposer coupled to the additional CPU socket(s); and one or more devices connected to the base interposer, wherein the base interposer provides a connection between the CPU and the one or more devices.

Abstract: A computing apparatus including a printed circuit board (PCB) including a first central processing unit (CPU) socket and additional CPU socket(s); a CPU coupled to the first CPU socket; a base interposer coupled to the additional CPU socket(s); and one or more devices connected to the base interposer, wherein the base interposer provides a connection between the CPU and the one or more devices.

Abstract: A modular, scalable and expandable (MSE) rack-based information handling system (RIHS) includes: a rack assembly having a frame that defines: a front bay chassis with height, depth and width dimensions that enable insertion of a plurality of different sizes of IT gear; and a rear bay that accommodates power and cooling components to support operation of the different sizes of IT gear. The power and cooling for the IT gear are provided from the rear bay and are separate from and independent of the IT gear installed within the front bay chassis. The rack assembly further includes a power and management chassis in which is inserted a power and management module having power and management components located thereon to provide rack-level power and management. A modular configuration of fan modules are inserted within fan receptacles within the rear bay to provide block level cooling of adjacent blocks of IT gear.

Abstract: A modular, scalable and expandable (MSE) rack-based information handling system (RIHS) includes: a rack assembly having a frame that defines: a front bay chassis with height, depth and width dimensions that enable insertion of a plurality of different sizes of IT gear; and a rear bay that accommodates power and cooling components to support operation of the different sizes of IT gear. The power and cooling for the IT gear are provided from the rear bay and are separate from and independent of the IT gear installed within the front bay chassis. The rack assembly further includes a power and management chassis in which is inserted a power and management module having power and management components located thereon to provide rack-level power and management. A modular configuration of fan modules are inserted within fan receptacles within the rear bay to provide block level cooling of adjacent blocks of IT gear.

Abstract: An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within/at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable.

Abstract: An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within/at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable.

Abstract: A system and method for controlling server chassis cooling fans includes monitoring operating temperatures associated with each of a plurality of temperature sensors. The temperature sensors may be coupled with a plurality of respective server processing cards. In accordance with a particular embodiment of the present invention, the operating speed of each of a plurality of server chassis cooling fans coupled with a server chassis is increased, in response to an operating temperature exceeding a predetermined maximum operating temperature measured at any one of the plurality of temperature sensors. In accordance with another embodiment of the present invention, the operating speed of each of the plurality of server chassis cooling fans is decreased in response to an operating temperature below a predetermined minimum operating temperature measured at each of the plurality of temperature sensors.