Abstract: An amalgamation preform is provided. The amalgamation preform includes a base metal, and a plurality of types of solid particles dispersed in the base metal, the base metal including one of a liquid base metal and a solid base metal. The plurality of types of solid particles at least includes: non-reactive magnetic particles, responsive to a magnetic field for controllably dispersing the plurality of types of solid particles in the base metal, and reactive particles, reactable with the base metal under the magnetic field.

Abstract: A method of using an amalgamation preform includes providing mating bonding surfaces and placing a particle-liquid mixture corresponding to the amalgamation preform between the mating bonding surfaces. The particle-liquid mixture contains a plurality of types of solid particles and a base metal in a liquid form, and the plurality of types of solid particles at least includes reactive particles reactable with the base metal and non-reactive magnetic particles. A first magnetic field is applied to the particle-liquid mixture to magnetically disperse the plurality of types of solid particles in the liquid base metal to form a particle-liquid dispersion; and a second magnetic field is applied to cure the particle-liquid dispersion to allow reactions between the reactive particles and the base metal.

Abstract: A method of making an amalgamation preform includes providing a particle-liquid mixture containing a plurality of types of solid particles and a liquid base metal. The plurality of types of solid particles at least includes reactive particles, reactable with the base metal, and non-reactive magnetic particles. A magnetic field is applied to the particle-liquid mixture to magnetically disperse the plurality of types of solid particles in the liquid base metal to form a particle-liquid dispersion without substantially inducing a reaction between the reactive particles and the liquid base metal. A playdough-like amalgamation preform is prepared based on the particle-liquid dispersion without solidifying the liquid base metal.

Abstract: A method of using an amalgamation preform includes providing mating bonding surfaces and placing a particle-liquid mixture corresponding to the amalgamation preform between the mating bonding surfaces. The particle-liquid mixture contains a plurality of types of solid particles and a base metal in a liquid form, and the plurality of types of solid particles at least includes reactive particles reactable with the base metal and non-reactive magnetic particles. A first magnetic field is applied to the particle-liquid mixture to magnetically disperse the plurality of types of solid particles in the liquid base metal to form a particle-liquid dispersion; and a second magnetic field is applied to cure the particle-liquid dispersion to allow reactions between the reactive particles and the base metal.

Abstract: A method of making an amalgamation preform includes providing a particle-liquid mixture containing a plurality of types of solid particles and a liquid base metal. The plurality of types of solid particles at least includes reactive particles, reactable with the base metal, and non-reactive magnetic particles. A magnetic field is applied to the particle-liquid mixture to magnetically disperse the plurality of types of solid particles in the liquid base metal to form a particle-liquid dispersion without substantially inducing a reaction between the reactive particles and the liquid base metal. A playdough-like amalgamation preform is prepared based on the particle-liquid dispersion without solidifying the liquid base metal.

Abstract: An amalgamation preform is provided. The amalgamation preform includes a base metal, and a plurality of types of solid particles dispersed in the base metal, the base metal including one of a liquid base metal and a solid base metal. The plurality of types of solid particles at least includes: non-reactive magnetic particles, responsive to a magnetic field for controllably dispersing the plurality of types of solid particles in the base metal, and reactive particles, reactable with the base metal under the magnetic field.

Abstract: A problem exists of prohibitively high costs associated with molds for small run, legacy, or prototype injection molded parts. Further, the lead time on molds is currently on the order of about two weeks. A mold is provided that is formed from three-dimensional printing. The mold includes a series of air and/or water cooling channels to limit thermal stresses to the mold. Additionally, a series of coatings is added to the surface of a 3D printed mold to extend the lifetime of the mold and increase the performance of the mold. The coatings perform a function other than to define a shape of an injection cavity, such as improving thermal conductivity, providing a thermal barrier between the injection material and the mold body, or improving the detachment of the final mold product from the mold body.

Abstract: A problem exists of prohibitively high costs associated with molds for small run, legacy, or prototype injection molded parts. Further, the lead time on molds is currently on the order of about two weeks. A mold is provided that is formed from three-dimensional printing. The mold includes a series of air and/or water cooling channels to limit thermal stresses to the mold. Additionally, a series of coatings is added to the surface of a 3D printed mold to extend the lifetime of the mold and increase the performance of the mold. The coatings perform a function other than to define a shape of an injection cavity, such as improving thermal conductivity, providing a thermal barrier between the injection material and the mold body, or improving the detachment of the final mold product from the mold body.

Abstract: A problem exists of prohibitively high costs associated with molds for small run, legacy, or prototype injection molded parts. Further, the lead time on molds is currently on the order of about two weeks. A mold is provided that is formed from three-dimensional printing. The mold includes a series of air and/or water cooling channels to limit thermal stresses to the mold. Additionally, a series of coatings is added to the surface of a 3D printed mold to extend the lifetime of the mold and increase the performance of the mold. The coatings perform a function other than to define a shape of an injection cavity, such as improving thermal conductivity, providing a thermal barrier between the injection material and the mold body, or improving the detachment of the final mold product from the mold body.

Abstract: An article with controllable wettability includes a substrate and a layer of a composite material supported on the substrate. The layer has an exposed surface and the composite material includes particles that have controllable polarization embedded fully or partially in a matrix. A controller is operable to selectively apply a controlled variable activation energy to the layer. The controllable polarization of the particles varies responsive to the controlled variable activation energy such that a wettability of the exposed surface also varies responsive to the controlled variable activation energy.

Abstract: An article with controllable wettability includes a substrate and a layer of a composite material supported on the substrate. The layer has an exposed surface and the composite material includes particles that have controllable polarization embedded fully or partially in a matrix. A controller is operable to selectively apply a controlled variable activation energy to the layer. The controllable polarization of the particles varies responsive to the controlled variable activation energy such that a wettability of the exposed surface also varies responsive to the controlled variable activation energy.

Abstract: The present disclosure provides improved systems and methods for low-temperature bonding and/or sealing with spaced nanorods. In exemplary embodiments, the present disclosure provides for the use of metallic nanorods to bond and seal two substrates. The properties of the resulting bond are mechanical strength comparable to adhesives, impermeability comparable to metals and long term stability comparable to metals. The bond may be attached to any flat substrate and superstate with strong adhesion. In certain embodiments, the bond is achieved at room temperature with only pressure or at a temperature above room temperature (e.g., about 150° C. or less) and reduced pressure. Exemplary bonds are both mechanically strong and substantially impermeable to oxygen and moisture.