Abstract: A multifunctional indirectly heated rotary kiln is provided to perform pyrolysis, calcining, roasting, thermal decomposition, and gasification for a variety of organic and inorganic feedstocks. The kiln operates over a temperature range from 100 degrees to 1,800 degrees Fahrenheit, can run in continuous or batch mode, and allows either co-current or counter-current operation. A feedstock is fed into a kiln and the thermally treated product is extracted. A plurality of paddles is provided at an interior surface of the kiln to allow maximum heat uptake by reactants through extended time in contact with the interior kiln walls. Feed screw and extraction screw assemblies are provided on portable carts to facilitate component swapping when a component becomes full or empty.

Abstract: An apparatus monitoring calls of a system includes a processor and memory causing the apparatus to perform operations including capturing recordings of calls in real-time from recorded devices. The processor may further cause the apparatus to compare audio call data of the calls detected by a switch with audio content of recorded calls by recorder devices to determine whether the audio call data matches the audio content of recorded calls. The processor may further cause the apparatus to monitor conditions of recorder devices during calls to determine whether a component(s) of recorder devices or of communication devices exceeds a threshold. The processor may further cause the apparatus to monitor memory in which recorded calls are transferred for archiving to determine whether there is enough storage in the memory. The processor may further cause the apparatus to determine metrics impacting quality of recorded calls and perform analytics on the recorded calls.

Abstract: Methods for functionalizing the surface of nanofiber substrates, including electrospun fibers and non-woven or woven mats of fibers are described. Functionalized nanofiber substrates presenting biologically active moieties such as biotin and saccharides are described.

Abstract: An apparatus monitoring calls of a system includes a processor and memory causing the apparatus to perform operations including capturing recordings of calls in real-time from recorded devices. The processor may further cause the apparatus to compare audio call data of the calls detected by a switch with audio content of recorded calls by recorder devices to determine whether the audio call data matches the audio content of recorded calls. The processor may further cause the apparatus to monitor conditions of recorder devices during calls to determine whether a component(s) of recorder devices or of communication devices exceeds a threshold. The processor may further cause the apparatus to monitor memory in which recorded calls are transferred for archiving to determine whether there is enough storage in the memory. The processor may further cause the apparatus to determine metrics impacting quality of recorded calls and perform analytics on the recorded calls.

Abstract: The invention generally relates to power converters, and more particularly to a communications method for controlling at least one power switching device of a power converter, a communications system for a power converter, and a power converter comprising the communications system.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

Abstract: A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: A pre-operative composition for sedation or analgesia is used to sedate a patient before a medical procedure. The pre-operative composition is formulated to prevent negative effects felt by the patient after the medical procedure. The pre-operative composition includes dexmedetomidine, midazolam, and some kind of pharmaceutical carrier. The pre-operative composition can be administered in a variety of methods to the patient. The preferred method of administering the pre-operative composition is either orally or by a syringe.

Abstract: Methods of preparing a functionalized nanofiber preparing a dispersion of a polymer and a water soluble synthetic construct of the structure F-S-L in admixture in a liquid medium; and then electrospinning the polymer from the liquid medium to provide the functionalized nanofiber. F is the functional moiety, L is a lipid and S is a spacer linking F to L via covalent bonds.

Abstract: We describe a system for controlling very large numbers of power semiconductor switching devices (132) to switch in synchronization. The devices are high power devices, for example carrying hundreds of amps and/or voltages of the order of kilovolts. In outline the system comprises a coordinating control system (110, 120), which communicates with a plurality of switching device controllers (130) to control the devices into a plurality of states including a fully-off state, a saturated-on state, and at least one intermediate state between the fully-off and saturated-on states, synchronizing the devices in the at least one intermediate state during switching.

Abstract: Methods for functionalizing the surface of nanofiber substrates, including electrospun fibres and non-woven or woven mats of fibres are described. Functionalised nanofiber substrates presenting biologically active moieties such as biotin and saccharides are described.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.