Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to improve webservers using dynamic load balancers. An example method includes identifying a first and second data object type associated with media and with first and second data objects of the media. The example method also includes enqueuing first and second event data associated with the first and second data object in a first and second queue in first circuitry in a die of programmable circuitry. The example method further includes dequeuing the first and second event data into a third and fourth queue associated with a first and second core of the programmable circuitry, the first circuitry separate from the first core and the second core. The example method additionally includes causing the first and second core to execute a first and second computing operation based on the first and second event data in the third and fourth queues.

Abstract: An intelligent supply-chain wide tracking and analysis system is described. In some instances, the system may receive variant data describing a variant of a product from a first client system, generate a variant profile based on the variant data, and determine a connection definition specific to the variant profile and defining a connection between the first client system and a second system. The system may provide access to a first data field containing data in the client profile from the first client system to the second client system based on the connection definition. The system may also receive an inventory value for the variant from the second client system and, using the variant profile and connection definition, provide access to the inventory value to the first client system.

Abstract: A conjugate comprising a protein or a peptide, a linker and an active agent, wherein the linker comprises the moiety of formula (III): (III) wherein two of A1, A2 and A3 are N and the other of A1, A2 and A3 is CH; X is selected from N, O and S, and Pep indicates where the moiety is linked to the protein or peptide, either directly or indirectly.

Abstract: Methods and apparatus for providing self-contained guidance, navigation, and control (GN&C) functions for a vehicle moving through an environment on or near the ground, in the air or in space without externally provided information are disclosed. More particularly, one embodiment of the present invention includes a Heading Sensor (36), an Absolute Location Sensor (38), a timer (40), a Range Doppler Processor (42), a Navigation Reference Sensor (44), an Area Range and a Velocity Sensor (46) which provide enhanced navigation information about a universal reference frame (22) and one or more targets (20).

Abstract: Methods and apparatus for providing self-contained guidance, navigation, and control (GN&C) functions for a vehicle moving through an environment on or near the ground, in the air or in space without externally provided information are disclosed. More particularly, one embodiment of the present invention includes a Heading Sensor (36), an Absolute Location Sensor (38), a timer (40), a Range Doppler Processor (42), a Navigation Reference Sensor (44), an Area Range and a Velocity Sensor (46) which provide enhanced navigation information about a universal reference frame (22) and one or more targets (20).

Abstract: Methods and apparatus for providing self-contained guidance, navigation, and control (GN&C) functions for a vehicle moving through an environment on or near the ground, in the air or in space without externally provided information are disclosed. More particularly, one embodiment of the present invention includes a Heading Sensor (36), an Absolute Location Sensor (38), a timer (40), a Range Doppler Processor (42), a Navigation Reference Sensor (44), an Area Range and a Velocity Sensor (46) which provide enhanced navigation information about a universal reference frame (22) and one or more targets (20).

Abstract: An apparatus monitoring calls of a system includes a processor and memory causing the apparatus to perform operations including capturing recordings of calls in real-time from recorded devices. The processor may further cause the apparatus to compare audio call data of the calls detected by a switch with audio content of recorded calls by recorder devices to determine whether the audio call data matches the audio content of recorded calls. The processor may further cause the apparatus to monitor conditions of recorder devices during calls to determine whether a component(s) of recorder devices or of communication devices exceeds a threshold. The processor may further cause the apparatus to monitor memory in which recorded calls are transferred for archiving to determine whether there is enough storage in the memory. The processor may further cause the apparatus to determine metrics impacting quality of recorded calls and perform analytics on the recorded calls.

Abstract: Methods for functionalizing the surface of nanofiber substrates, including electrospun fibers and non-woven or woven mats of fibers are described. Functionalized nanofiber substrates presenting biologically active moieties such as biotin and saccharides are described.

Abstract: An apparatus monitoring calls of a system includes a processor and memory causing the apparatus to perform operations including capturing recordings of calls in real-time from recorded devices. The processor may further cause the apparatus to compare audio call data of the calls detected by a switch with audio content of recorded calls by recorder devices to determine whether the audio call data matches the audio content of recorded calls. The processor may further cause the apparatus to monitor conditions of recorder devices during calls to determine whether a component(s) of recorder devices or of communication devices exceeds a threshold. The processor may further cause the apparatus to monitor memory in which recorded calls are transferred for archiving to determine whether there is enough storage in the memory. The processor may further cause the apparatus to determine metrics impacting quality of recorded calls and perform analytics on the recorded calls.

Abstract: The invention generally relates to power converters, and more particularly to a communications method for controlling at least one power switching device of a power converter, a communications system for a power converter, and a power converter comprising the communications system.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

Abstract: A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

Abstract: A pre-operative composition for sedation or analgesia is used to sedate a patient before a medical procedure. The pre-operative composition is formulated to prevent negative effects felt by the patient after the medical procedure. The pre-operative composition includes dexmedetomidine, midazolam, and some kind of pharmaceutical carrier. The pre-operative composition can be administered in a variety of methods to the patient. The preferred method of administering the pre-operative composition is either orally or by a syringe.