Patents by Inventor Stephen Paul Ashworth
Stephen Paul Ashworth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250022635Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.Type: ApplicationFiled: January 12, 2024Publication date: January 16, 2025Inventors: Stephen Paul ASHWORTH, Franco Moriconi, Timothy David Heidel
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Patent number: 12020831Abstract: Power transmission systems with cooling mechanisms, and methods of operating the same, are described. A power transmission system can include multiple support tower assemblies. Each of the support tower assemblies includes a support tower. One or more of the support tower assemblies includes a termination (i.e., a connection point via which electrical current and/or coolant can enter the transmission line and/or exit the transmission line). The power transmission system also includes multiple conductor assemblies suspended above a surface of the earth. Each conductor assembly includes an electrical conductor and is positioned between, and mechanically supported by, a pair of the support towers. The power transmission system also includes a coolant supply system that delivers a coolant fluid, during operation of the power transmission system, to at least one of the terminations, for cooling of the conductor assemblies.Type: GrantFiled: January 10, 2023Date of Patent: June 25, 2024Assignee: VEIR, Inc.Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
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Patent number: 11908593Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.Type: GrantFiled: November 22, 2022Date of Patent: February 20, 2024Assignee: VEIR, Inc.Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
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Publication number: 20230386705Abstract: Power transmission systems with cooling mechanisms, and methods of operating the same, are described. A power transmission system can include multiple support tower assemblies. Each of the support tower assemblies includes a support tower. One or more of the support tower assemblies includes a termination (i.e., a connection point via which electrical current and/or coolant can enter the transmission line and/or exit the transmission line). The power transmission system also includes multiple conductor assemblies suspended above a surface of the earth. Each conductor assembly includes an electrical conductor and is positioned between, and mechanically supported by, a pair of the support towers. The power transmission system also includes a coolant supply system that delivers a coolant fluid, during operation of the power transmission system, to at least one of the terminations, for cooling of the conductor assemblies.Type: ApplicationFiled: January 10, 2023Publication date: November 30, 2023Applicant: VEIR, Inc.Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
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Publication number: 20230269907Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.Type: ApplicationFiled: November 21, 2022Publication date: August 24, 2023Applicant: VEIR, Inc.Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
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Publication number: 20230223170Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.Type: ApplicationFiled: November 22, 2022Publication date: July 13, 2023Applicant: VEIR, Inc.Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
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Patent number: 11581109Abstract: Power transmission systems with cooling mechanisms, and methods of operating the same, are described. A power transmission system can include multiple support tower assemblies. Each of the support tower assemblies includes a support tower. One or more of the support tower assemblies includes a termination (i.e., a connection point via which electrical current and/or coolant can enter the transmission line and/or exit the transmission line). The power transmission system also includes multiple conductor assemblies suspended above a surface of the earth. Each conductor assembly includes an electrical conductor and is positioned between, and mechanically supported by, a pair of the support towers. The power transmission system also includes a coolant supply system that delivers a coolant fluid, during operation of the power transmission system, to at least one of the terminations, for cooling of the conductor assemblies.Type: GrantFiled: November 11, 2021Date of Patent: February 14, 2023Assignee: Veir, Inc.Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
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Patent number: 11538607Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.Type: GrantFiled: May 23, 2022Date of Patent: December 27, 2022Assignee: Veir, Inc.Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
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Patent number: 11540419Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.Type: GrantFiled: May 12, 2022Date of Patent: December 27, 2022Assignee: Veir, Inc.Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
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Publication number: 20220277873Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.Type: ApplicationFiled: May 23, 2022Publication date: September 1, 2022Applicant: VEIR, Inc.Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
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Publication number: 20220272867Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.Type: ApplicationFiled: May 12, 2022Publication date: August 25, 2022Applicant: VEIR, Inc.Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
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Publication number: 20220254550Abstract: Power transmission systems with cooling mechanisms, and methods of operating the same, are described. A power transmission system can include multiple support tower assemblies. Each of the support tower assemblies includes a support tower. One or more of the support tower assemblies includes a termination (i.e., a connection point via which electrical current and/or coolant can enter the transmission line and/or exit the transmission line). The power transmission system also includes multiple conductor assemblies suspended above a surface of the earth. Each conductor assembly includes an electrical conductor and is positioned between, and mechanically supported by, a pair of the support towers. The power transmission system also includes a coolant supply system that delivers a coolant fluid, during operation of the power transmission system, to at least one of the terminations, for cooling of the conductor assemblies.Type: ApplicationFiled: November 11, 2021Publication date: August 11, 2022Applicant: VEIR, Inc.Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
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Patent number: 11373784Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.Type: GrantFiled: November 11, 2021Date of Patent: June 28, 2022Assignee: Veir, Inc.Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
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Patent number: 11363741Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.Type: GrantFiled: November 11, 2021Date of Patent: June 14, 2022Assignee: Veir, Inc.Inventors: Stephen Paul Ashworth, Franco Moriconi, Timothy David Heidel
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Publication number: 20220159873Abstract: A cooling system includes a coolant transmitter that transmits coolant at a pressure greater than atmospheric pressure. The cooling system also includes an evaporation vessel at atmospheric pressure. The evaporation vessel can contain an amount of coolant at the boiling point of the coolant. The cooling system also includes a pressure reducer fluidically coupled to the coolant transmitter and the evaporation vessel. The pressure reducer can include an orifice. The cooling system is configured such that heat is transferred from the coolant in the coolant transmitter to the coolant contained in the evaporation vessel. An exit stream conduit can fluidically couple the coolant transmitter and the pressure reducer, with the exit stream conduit diverting a portion of the coolant from the coolant transmitter to the evaporation vessel.Type: ApplicationFiled: November 11, 2021Publication date: May 19, 2022Applicant: VEIR, Inc.Inventors: Stephen Paul ASHWORTH, Franco MORICONI, Timothy David HEIDEL
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Publication number: 20220157495Abstract: A conductor assembly for transmitting power includes a former that defines a shape, a superconductor material disposed around the former, and a thermally insulating jacket (TIJ) disposed around and spaced apart from the superconductor material. An outer surface of the superconductor material and an inner surface of the TIJ can define an annulus through which a coolant can flow. The conductor assembly can also include an external layer, disposed around an outside surface of the TIJ, to provide structural support to the conductor assembly. The conductor assembly can also include an electrical insulation layer disposed around the outside surface of the TIJ or around the superconductor material.Type: ApplicationFiled: November 11, 2021Publication date: May 19, 2022Applicant: VEIR, Inc.Inventors: Stephen Paul Ashworth, Franco Mariconi, Timothy David Heidel
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Patent number: 9638827Abstract: A bottom hole assembly used for a field operation is disclosed herein. The bottom hole assembly can include at least one directional antenna disposed on an outer surface of a first tubing pipe of a tubing string, where the at least one directional antenna receives a first electric current from at least one power source, where the first electric current generates a first magnetic field that radiates from the at least one directional antenna into a formation. The bottom hole assembly can also include at least one receiver disposed on a second tubing pipe of the tubing string, where the at least one receiver receives the first magnetic field returning from the formation.Type: GrantFiled: September 26, 2014Date of Patent: May 2, 2017Assignees: LOS ALAMOS NATIONAL SECURITY, LLC, CHEVRON U.S.A. INC.Inventors: David Wesley Reagor, Doan Ngoc Nguyen, Stephen Paul Ashworth
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Publication number: 20160091628Abstract: A bottom hole assembly used for a field operation is disclosed herein. The bottom hole assembly can include at least one directional antenna disposed on an outer surface of a first tubing pipe of a tubing string, where the at least one directional antenna receives a first electric current from at least one power source, where the first electric current generates a first magnetic field that radiates from the at least one directional antenna into a formation. The bottom hole assembly can also include at least one receiver disposed on a second tubing pipe of the tubing string, where the at least one receiver receives the first magnetic field returning from the formation.Type: ApplicationFiled: September 26, 2014Publication date: March 31, 2016Applicants: CHEVRON U.S.A. INC., LOS ALAMOS NATIONAL SECURITY, LLCInventors: David Wesley Reagor, Doan Ngoc Nguyen, Stephen Paul Ashworth