Abstract: A system and process for the utilization of xylose during fermentation is described. The system uses a fermenter and a separate reactor to isomerize the xylose to xylulose. The separation of the two processes allows the optimization of each process since the isomerization operates ideally in a calcium free environment near pH 7.5 while the fermentation operates ideally below a pH of 6. Control of pH is assisted by the modulation of CO2 in the fermentation medium. Xylulose is fermented to ethanol by numerous standard yeasts although other products are also possible. The separate reactor may be run in a single pass, or, more preferably in a recirculating mode to allow full isomerization while the xylulose product is being consumed by the yeast. A preferred embodiment includes a Simultaneous Saccharification and Fermentation system where the liquid portion of the fermenting broth is isomerized and returned to the fermentation vessel.

Abstract: A composite partially reflecting element of a Fabry-Perot interferometer includes a transparent plate having a surface facing toward the optical gap of the interferometer, a partially reflecting layer disposed on the surface of the transparent plate facing toward the optical gap, and at least one protective layer on at least one side of the partially reflecting layer.

Abstract: A method of indicating the progress of a sacrificial material removal process, the method, comprising; freeing a portion of a member, the member being disposed in a cage and laterally surrounded by the sacrificial material; and preventing the freed portion of the member from floating away by retaining the freed member.

Abstract: A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, defining an actuating area for the MEMS device on the dielectric layer, including depositing a conductive material on the dielectric layer and communicating the conductive material with the at least one conductive layer of the substructure through the dielectric layer, forming a sacrificial layer over the conductive material and the dielectric layer, including depositing silicon over the conductive material and the dielectric layer, and forming a substantially planar surface of the silicon, forming an actuating element over the sacrificial layer within the actuating area, including communicating the actuating element with the conductive material of the actuating area through the sacrificial layer, and substantially removing the sacrificial layer between the ac

Abstract: A method of forming a MEMS device includes providing a substructure including a base material and at least one conductive layer formed on a side of the base material, forming a dielectric layer over the at least one conductive layer of the substructure, defining an actuating area for the MEMS device on the dielectric layer, including depositing a conductive material on the dielectric layer and communicating the conductive material with the at least one conductive layer of the substructure through the dielectric layer, forming a sacrificial layer over the conductive material and the dielectric layer, including depositing silicon over the conductive material and the dielectric layer, and forming a substantially planar surface of the silicon, forming an actuating element over the sacrificial layer within the actuating area, including communicating the actuating element with the conductive material of the actuating area through the sacrificial layer, and substantially removing the sacrificial layer between the ac