Abstract: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.

Abstract: An implantable medical device is manufactured with a hermetically sealed housing and a modular assembly enclosed within the housing. The modular assembly includes a circuit board, an electronic component mounted on a top surface of the circuit board, and a wall formed having an outer surface and an inner surface separated by a top edge and a bottom edge, the wall bottom edge positioned against the circuit board such that the wall encircles the electronic component coupled to the circuit board. The wall top edge is coupled to the housing a ferrule in one embodiment.

Abstract: A ceramic member with thick film conductors is mounted on a heat sink and a silicon integrated circuit (chip) is placed through a hole in the ceramic member and is soldered by a back surface (the substrate) to the heat sink. A tape automated bonding lead frame is used to provide conductors that are soldered to bonding pads on the ceramic member and are compression bonded to conductive bumps on the chip and to provide other conductors that are soldered to pads on the ceramic member and crossover a front active surface of the chip. These crossover conductors are air isolated from the chip and allow an increase in interconnect density. The attachment of the semiconductor substrate to the heat sink provides good heat dissipation.

Abstract: A method of bonding two integrated circuit chips in a face-to-face relationship to a single site of finger leads situated in a tape-type lead frame. The finger leads contained at a single site in a lead frame are divided into two groups and are bonded in two separate bonding processes. The first group has its inner free ends configured in combination with contact bumps on a first chip, effective to leave the second group of finger leads outside the peiphery of the first chip after bonding of the first chip to the tape. In the second bonding process, a second integrated circuit chip is placed beneath the tape that has a first integrated circuit chip already bonded to the top side of it and a heated thermode having a recess in its surface. The peripheral edge of the thermode is used to complete bonding of the second integrated circuit chip to the second group of finger leads at the same site of the lead frame.