Patents by Inventor Stephen R. BOSLEY

Stephen R. BOSLEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tight pitch wirings and capacitor(s)
    Patent number: 11380615
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plate of a second conductive material on the insulator material; and a plurality of wirings on a same level as the bottom plate and composed of the second conductive material.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: July 5, 2022
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Anthony K. Stamper, Daisy A. Vaughn, Stephen R. Bosley, Zhong-Xiang He
  • TIGHT PITCH WIRINGS AND CAPACITOR(S)
    Publication number: 20210134716
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plate of a second conductive material on the insulator material; and a plurality of wirings on a same level as the bottom plate and composed of the second conductive material.
    Type: Application
    Filed: December 11, 2020
    Publication date: May 6, 2021
    Inventors: Anthony K. STAMPER, Daisy A. VAUGHN, Stephen R. BOSLEY, Zhong-Xiang HE
  • Tight pitch wirings and capacitor(s)
    Patent number: 10910304
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plate of a second conductive material on the insulator material; and a plurality of wirings on a same level as the bottom plate and composed of the second conductive material.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: February 2, 2021
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Anthony K. Stamper, Daisy A. Vaughn, Stephen R. Bosley, Zhong-Xiang He
  • TIGHT PITCH WIRINGS AND CAPACITOR(S)
    Publication number: 20200243439
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plate of a second conductive material on the insulator material; and a plurality of wirings on a same level as the bottom plate and composed of the second conductive material.
    Type: Application
    Filed: January 24, 2019
    Publication date: July 30, 2020
    Inventors: Anthony K. STAMPER, Daisy A. VAUGHN, Stephen R. BOSLEY, Zhong-Xiang HE