Patents by Inventor Stephen R. Crown

Stephen R. Crown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6713381
    Abstract: An interconnect overlies a semiconductor device substrate (10). In one embodiment, a conductive barrier layer overlies a portion of the interconnect, a passivation layer (92) overlies the conductive barrier layer and the passivation layer (92) has an opening that exposes portions of the conductive barrier layer (82). In an alternate embodiment a passivation layer (22) overlies the interconnect, the passivation layer (22) has an opening (24) that exposes the interconnect and a conductive barrier layer (32) overlies the interconnect within the opening (24).
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: March 30, 2004
    Assignee: Motorola, Inc.
    Inventors: Alexander L. Barr, Suresh Venkatesan, David B. Clegg, Rebecca G. Cole, Olubunmi Adetutu, Stuart E. Greer, Brian G. Anthony, Ramnath Venkatraman, Gregor Braeckelmann, Douglas M. Reber, Stephen R. Crown
  • Patent number: 6597234
    Abstract: An anti-fuse useful in implementing redundancy in a memory utilizes a normal transistor characteristic that is generally considered undesirable in order to provide two easily detected states. The un-programmed state, which is the high impedance state, is achieved simply with a normal transistor in its non-conductive state. The programmed state, which is the low impedance state, is achieved by forcing a normal transistor to conduct current through its gate. This causes the gate dielectric to become permanently conductive. This programmed transistor then is conductive between its source and drain that is easily differentiated from the transistor that is held in its non-conductive state. The result is a fuse technology using an anti-fuse that provides for easily distinguishable programmed and un-programmed states achieved by electrical programming rather than by laser programming.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: July 22, 2003
    Assignee: Motorola, Inc.
    Inventors: Douglas M. Reber, Stephen R. Crown
  • Publication number: 20030112055
    Abstract: An anti-fuse useful in implementing redundancy in a memory utilizes a normal transistor characteristic that is generally considered undesirable in order to provide two easily detected states. The un-programmed state, which is the high impedance state, is achieved simply with a normal transistor in its nonconductive state. The programmed state, which is the low impedance state, is achieved by forcing a normal transistor to conduct current through its gate. This causes the gate dielectric to become permanently conductive. This programmed transistor then is conductive between its source and drain that is easily differentiated from the transistor that is held in its non-conductive state. The result is a fuse technology using an anti-fuse that provides for easily distinguishable programmed and un-programmed states achieved by electrical programming rather than by laser programming.
    Type: Application
    Filed: December 14, 2001
    Publication date: June 19, 2003
    Inventors: Douglas M. Reber, Stephen R. Crown
  • Publication number: 20020093098
    Abstract: An interconnect overlies a semiconductor device substrate (10). In one embodiment, a conductive barrier layer overlies a portion of the interconnect, a passivation layer (92) overlies the conductive barrier layer and the passivation layer (92) has an opening that exposes portions of the conductive barrier layer (82). In an alternate embodiment a passivation layer (22) overlies the interconnect, the passivation layer (22) has an opening (24) that exposes the interconnect and a conductive barrier layer (32) overlies the interconnect within the opening (24).
    Type: Application
    Filed: January 18, 2002
    Publication date: July 18, 2002
    Inventors: Alexander L. Barr, Suresh Venkatesan, David B. Clegg, Rebecca G. Cole, Olubunmi Adetutu, Stuart E. Greer, Brian G. Anthony, Ramnath Venkatraman, Gregor Braeckelmann, Douglas M. Reber, Stephen R. Crown
  • Publication number: 20020000665
    Abstract: An interconnect overlies a semiconductor device substrate (10). In one embodiment, a conductive barrier layer overlies a portion of the interconnect, a passivation layer (92) overlies the conductive barrier layer and the passivation layer (92) has an opening that exposes portions of the conductive barrier layer (82). In an alternate embodiment a passivation layer (22) overlies the interconnect, the passivation layer (22) has an opening (24) that exposes the interconnect and a conductive barrier layer (32) overlies the interconnect within the opening (24).
    Type: Application
    Filed: April 5, 1999
    Publication date: January 3, 2002
    Inventors: ALEXANDER L. BARR, SURESH VENKATESAN, DAVID B. CLEGG, REBECCA G. COLE, OLUBUNMI ADETUTU, STUART E. GREER, BRIAN G. ANTHONY, RAMNATH VENKATRAMAN, GREGOR BRAECKELMANN, DOUGLAS M. REBER, STEPHEN R. CROWN