Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

Abstract: A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame.

Abstract: A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame.

Abstract: A method of connecting electrical components and an electronic device formed using this method are disclosed. This method includes stretching a first substrate with a plurality of conductive traces to form a stretched substrate where at least one increased pitch (a spacing between two conductive traces plus a width of one conductive trace) is not greater than 40 microns; and electrically connecting the conductive traces on the first substrate to conductive traces on a second substrate. A device by which this method can be implemented is also disclosed, which includes a base, and platforms and stretchers mounted to the base that are configured to pull opposite ends of the first substrate to align the conductive traces thereon with the conductive traces on the second substrate.

Abstract: A fluid deposition device including a platen and a cartridge mount assembly is described. The platen is configured to support a substrate upon which a fluid will be deposited. The cartridge mount assembly includes a receptacle configured to receive a print cartridge and multiple electrical contacts configured to mate with corresponding electrical contacts on the print cartridge. In one implementation, the cartridge mount assembly further includes a vacuum connector configured to mate with a vacuum inlet included on the print cartridge. When the print cartridge is received in the receptacle, the print cartridge can form connections with the electrical contacts and with the vacuum connector of the receptacle at substantially the same time.

Abstract: A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions.

Abstract: A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions.

Abstract: A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions.

Abstract: A method of etching a silicon substrate is described. The method includes bonding a first silicon substrate to a sacrificial silicon substrate. The first silicon substrate is etched. A pressure is applied at an interface of the first silicon substrate and the sacrificial silicon substrate to cause the first silicon substrate to separate from the sacrificial silicon substrate. An apparatus having metal blades can be used to separate the substrates.

Abstract: A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions.

Abstract: A mounting assembly for a printhead assembly is described that can allow dynamic nozzle and drop placement adjustment in one or more directions.

Abstract: A method for forming at least one opening in a receptacle comprises the steps of providing a receptacle having a cover with an exterior surface and an interior surface covering a cavity. A cutting mechanism is also provided having at least one blade. The cover is pierced with the blade, and the blade is moved through the cover to cut a portion of the cover and create an opening in the cover to provide access into the cavity. Further, the cut portion curls on top of the exterior surface as the opening is created.

Abstract: A method for forming at least one opening in a receptacle comprises the steps of providing a receptacle having a cover with an exterior surface and an interior surface covering a cavity. A cutting mechanism is also provided having at least one blade. The cover is pierced with the blade, and the blade is moved through the cover to cut a portion of the cover and create an opening in the cover to provide access into the cavity. Further, the cut portion curls on top of the exterior surface as the opening is created.